描述 Description

Please note: this product is being discontinued and is not recommended for new designs.

The AWB7239 is a fully matched, Multi-Chip-Module(MCM) designed for picocell, femtocell, and customerpremises equipment (CPE) applications. Its highlinearity and efficiency meet the extremely demandingneeds of small cell infrastructure architectures.Designed for WCDMA, HSDPA, and LTE air interfacesoperating in the 1.880 GHz to 1.930 GHz band, theAWB7239 delivers up to +27 dBm of LTE (E-TM1.1)power with an ACPR of -47 dBc. It operates froma convenient +4.5 V supply and provides 30 dB ofgain. The device is manufactured using an advancedInGaP HBT MMIC technology offering state-of-theartreliability, temperature stability, and ruggedness.The self-contained 7 mm x 7 mm x 1.3 mm surfacemount package incorporates RF matching networksoptimized for output power, efficiency, and linearity ina 50 Ω system.

特性 Features

? InGaP HBT Technology
? -47 dBc ACPR @ ±10 MHz, +27 dBm
? 30 dB Gain
? High Efficiency
? Low Transistor Junction Temperature
? Matched for a 50 Ω System
? Low Profile Miniature Surface Mount Package; RoHS Compliant
? Multi-Carrier Capability