描述 Description

Please note: this product is being discontinued and is not recommended for new designs.

The AWB7223 is a fully matched, Multi-Chip-Module(MCM) designed for picocell, femtocell, and customerpremises equipment (CPE) applications. Its highlinearity and efficiency meet the extremely demandingneeds of small cell infrastructure architectures.Designed for WCDMA, HSDPA, and LTE air interfacesoperating in the 1.930 GHz to 1.995 GHz band, theAWB7223 delivers up to +27 dBm of WCDMA (64DPCH) power with an ACPR better than -50 dBc. Itoperates from a convenient +4.5 V supply and provides30.5 dB of gain. The device is manufactured using anadvanced InGaP HBT MMIC technology offeringstate-of-the-art reliability, temperature stability, andruggedness. The self-contained 7 mm x 7 mm x 1.3mm surface mount package incorporates RF matchingnetworks optimized for output power, efficiency, andlinearity in a 50 Ω system.

特性 Features

? InGaP HBT Technology
? -51 dBc ACPR @ 65 MHz, +27 dBm
? 30.5 dB Gain
? High Efficiency
? Low Transistor Junction Temperature
? Matched for a 50 Ω System
? Low Profile Miniature Surface Mount Package;
? RoHS Compliant
? Multi-Carrier Capability

簡介

AWB7223屬于RF/IF射頻/中頻RFID的射頻放大器。由制造生產(chǎn)的AWB7223射頻放大器在射頻應(yīng)用中，射頻放大器產(chǎn)品可用于信號增益和緩沖。這些產(chǎn)品與通用運(yùn)算放大器的不同之處在于，它們通常適用于更高的頻率，更傾向于提供不可調(diào)節(jié)的固定增益，并且輸入或輸出阻抗值符合常用傳輸線特性阻抗。