描述 Description

Please note: this product is being discontinued and is not recommended for new designs.

The AWB7238 is a fully matched, Multi-Chip-Module(MCM) designed for picocell, femtocell, and customerpremises equipment (CPE) applications. Consisting oftwo parallel path high linearity, high efficiency poweramplifiers, the device meets the extremely demandingneeds of small cell infrastructure architectures.Designed for LTE, WCDMA and HSDPA air interfacesoperating in the 791 MHz to 821 MHz bands, theAWB7238 delivers up to +27 dBm of LTE (E-TM1.1)power through an external 90-degree hybrid coupler,with an ACPR of -47 dBc. The device operates froma convenient +4.5 V supply and provides 30 dB ofRF gain. The AWB7238 is manufactured using anadvanced InGaP HBT MMIC technology offeringstate-of-the-art reliability, temperature stability, andruggedness. Its 7 mm x 7 mm x 1.3 mm surfacemount package incorporates RF matching networksoptimized for output power, efficiency, and linearity ina 50 Ω system.

特性 Features

? InGaP HBT Technology
? -47 dBc ACPR @ ±10 MHz, +27 dBm
? 30 dB Gain
? High Efficiency
? Low Transistor Junction Temperature
? Matched for a 50 Ω System
? Low Profile Miniature Surface Mount Package; RoHS Compliant
? Multi-Carrier Capability