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首頁(yè)>66AK2H06DAAW24>規(guī)格書(shū)詳情

66AK2H06DAAW24中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

66AK2H06DAAW24
廠商型號(hào)

66AK2H06DAAW24

功能描述

66AK2Hxx Multicore DSPARM? KeyStone? II System-on-Chip (SoC)

絲印標(biāo)識(shí)

66AK2H06AAW

封裝外殼

FCBGA

文件大小

2.92701 Mbytes

頁(yè)面數(shù)量

329 頁(yè)

生產(chǎn)廠商

TI2

中文名稱(chēng)

德州儀器

網(wǎng)址

網(wǎng)址

數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-8-7 19:45:00

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66AK2H06DAAW24規(guī)格書(shū)詳情

1.1 Features 1

? Eight TMS320C66x DSP Core Subsystems (C66x

CorePacs), Each With

– 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-

Point DSP Core

– 38.4 GMacs/Core for Fixed Point @ 1.2 GHz

– 19.2 GFlops/Core for Floating Point @ 1.2

GHz

– Memory

– 32-KB L1P Per CorePac

– 32-KB L1D Per CorePac

– 1024-KB Local L2 Per CorePac

? ARM CorePac

– Four ARM? Cortex?-A15 MPCore? Processors

at up to 1.4 GHz

– 4MB of L2 Cache Memory Shared by Four ARM

Cores

– Full Implementation of ARMv7-A Architecture

Instruction Set

– 32-KB L1 Instruction and Data Caches per Core

– AMBA 4.0 AXI Coherency Extension (ACE)

Master Port, Connected to MSMC for Low-

Latency Access to Shared MSMC SRAM

? Multicore Shared Memory Controller (MSMC)

– 6MB of MSM SRAM Memory Shared by Eight

DSP CorePacs and One ARM CorePac

– Memory Protection Unit (MPU) for Both MSM

SRAM and DDR3_EMIF

? Multicore Navigator

– 16k Multipurpose Hardware Queues With

Queue Manager

– Packet-Based DMA for Zero-Overhead

Transfers

? Network Coprocessor

– Packet Accelerator Enables Support for

– Transport Plane IPsec, GTP-U, SCTP, PDCP

– L2 User Plane PDCP (RoHC, Air Ciphering)

– 1-Gbps Wire Speed Throughput at 1.5

MPackets Per Second

– Security Accelerator Engine Enables Support for

– IPSec, SRTP, 3GPP, and WiMAX Air

Interface, and SSL/TLS Security

– ECB, CBC, CTR, F8, A5/3, CCM, GCM,

HMAC, CMAC, GMAC, AES, DES, 3DES,

Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit

Hash), MD5

– Up to 2.4 Gbps IPSec and 2.4 Gbps Air

Ciphering

– Ethernet Subsystem

– Five-Port Switch (Four SGMII Ports)

? Peripherals

– Four Lanes of SRIO 2.1

– Supports up to 5 GBaud

– Supports Direct I/O, Message Passing

– Two Lanes PCIe Gen2

– Supports up to 5 GBaud

– Two HyperLinks

– Supports Connections to Other KeyStone?

Architecture Devices Providing Resource

Scalability

– Supports up to 50 GBaud

– 10-Gigabit Ethernet (10-GbE) Switch Subsystem

(66AK2H14 Only)

– Two XFI Ports

– IEEE 1588 Support

– Five Enhanced Direct Memory Access (EDMA)

Modules

– Two 72-Bit DDR3/DDR3L Interfaces With

Speeds up to 1600 MHz

– EMIF16 Interface

– USB 3.0

– Two UART Interfaces

– Three I2C Interfaces

– 32 GPIO Pins

– Three SPI Interfaces

– Semaphore Module

– 64-Bit Timers

– Twenty 64-Bit Timers for 66AK2H14 and

66AK2H12

– Fourteen 64-Bit Timers for 66AK2H06

– Five On-Chip PLLs

? Commercial Case Temperature:

– 0oC to 85oC

? Extended Case Temperature:

– –40oC to 100oC

1.2 Applications

? Mission Critical

? Computing

? Communications

? Audio

? Video Infrastructure.

? Imaging

? Analytics

? Networking

? Media Processing

1.3 Description

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x

high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to

5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet

switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded

infrastructure applications like cloud computing, media processing, high-performance computing,

transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without

sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core

and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with

software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point

(FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an

assembly optimizer to simplify programming and scheduling, and a Windows? debugger interface for

visibility into source code execution.

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
Texas Instruments
20+
FCBGA-1517
15988
TI全新DSP-可開(kāi)原型號(hào)增稅票
詢(xún)價(jià)
TI
25+
(AAW)
6000
原廠原裝,價(jià)格優(yōu)勢(shì)
詢(xún)價(jià)
Texas Instruments
21+
56-VFBGA
500
進(jìn)口原裝!長(zhǎng)期供應(yīng)!絕對(duì)優(yōu)勢(shì)價(jià)格(誠(chéng)信經(jīng)營(yíng)
詢(xún)價(jià)
TI/德州儀器
25+
FCBGA-1517
860000
明嘉萊只做原裝正品現(xiàn)貨
詢(xún)價(jià)
Texas Instruments(德州儀器)
22+
NA
500000
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂
詢(xún)價(jià)
TI
16+
FCBGA
10000
原裝正品
詢(xún)價(jià)
TI
24+
N/A
90000
一級(jí)代理商進(jìn)口原裝現(xiàn)貨、價(jià)格合理
詢(xún)價(jià)
Texas
25+
25000
原廠原包 深圳現(xiàn)貨 主打品牌 假一賠百 可開(kāi)票!
詢(xún)價(jià)
TI
三年內(nèi)
1983
只做原裝正品
詢(xún)價(jià)
TI/德州儀器
23+
-
6000
原廠授權(quán)代理,海外優(yōu)勢(shì)訂貨渠道??商峁┐罅繋?kù)存,詳
詢(xún)價(jià)