描述 Description

FNB81560T3 is a Motion SPM 8 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs tominimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, inter-lock function, over-current shutdown, thermal monitoring of drive IC, and fault reporting. Thebuilt-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module's robust shortcircuit-rated IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms.

特性 Features

? UL Certified No. E209204 (UL1557)
? 600V - 15A 3-Phase IGBT Inverter Control IC for Gate Drive and Protections
? Low-Loss, Short-Circuit Rated IGBTs
? Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing
? Active-high interface, works with 3.3 / 5 V Logic, Schmitt-trigger Input
? HVIC for Gate Driving, Under-Voltage and Short-Circuit Current Protection
? Fault Output for Under-Voltage and Short-Circuit Current Protection
? Inter-Lock Function to Prevent Short-Circuit
? Shut-Down Input
? HVIC Temperature-Sensing Built-In for Temperature Monitoring
? Isolation Rating: 1500 Vrms / min

簡介

FNB81560T3屬于分立半導(dǎo)體產(chǎn)品的功率驅(qū)動器模塊。由制造生產(chǎn)的FNB81560T3功率驅(qū)動器模塊功率驅(qū)動器模塊為電源組件（通常為半橋或單相、兩相或三相配置的 IGBT 和 MOSFET）提供物理防護。功率半導(dǎo)體或裸片將焊接或燒結(jié)在基材上，后者可承載功率半導(dǎo)體并在需要時提供電和熱觸點以及電絕緣。功率模塊提供更高的功率密度，并且在許多情況下更可靠且更易于冷卻。