描述 Description

1200V IHM 130mm Dual IGBT Module with IGBT 3 - The best solution for your industry applications

特性 Features

·High reliability and robust module construction
·UL recognised

應(yīng)用 Application

????This 1200V IHM Module can be combined with our dedicated Evaluation Board.MA400E12Please select a matching HV Gate Driver IC from our EiceDRIVER? Portfolio.With Infineon EiceDRIVER? Enhanced and Compact Driver ICs as well as EiceDRIVER? Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.FF600R12KE3Data Sheet (141 KB, EN/DE)ParametricFF600R12KE3Configuration?DualIC(nom) / IF(nom) ?600.0A?VCE(sat)(Tvj=25°C typ)?1.7V?VF(Tvj=25°C typ)?2.0V?Housing?IHMDimensions(length)?130.0mm?Dimensions(width)?140.0mm?Data SheetTitleSizeDateVersionFF600R12KE3EN/DE141 KB17 八月 200702_00Product BrochureTitleSizeDateVersion1EDI EiceDRIVER? Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIHM 和 IHV 模塊使用及安裝指南CNEN2.4 MB09 十二月 2013Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用單極柵電壓驅(qū)動IGBTCNEN384 KB03 十一月 201501_00MA400E12/17 與 MA401E12/17 – 用于IHM IGBT 模塊的模塊適配板CNEN1.4 MB26 十一月 2013Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009E3和T3系列1200V IGBT3 模塊的性能差異CNEN330 KB25 十一月 2013等效熱路模型CNEN500 KB25 十一月 2013如何正確計(jì)算并最大限度減小 IGBT 的死區(qū)時間CNEN1.5 MB26 八月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionIHM, IHV Modules & PrimePACK?EN452 KB27 四月 201608_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Wind Energy SystemsEN5.4 MB18 四月 2013Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Solutions for Traction SystemsEN2.9 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00Material Content Data SheetTitleSizeDateVersionMCDS - IIH2 140x130 Cu LKEN40 KB17 十二月 201304_00銷售產(chǎn)品名稱FF600R12KE3OPNFF600R12KE3NOSA1產(chǎn)品狀態(tài)discontinued在線訂購封裝名稱A-IHM130-2無鉛產(chǎn)品no無鹵no通過無鉛認(rèn)證no包裝規(guī)格2包裝類型TRAY評估板評估板系列描述狀態(tài)MA400E12IGBT Modules, Gate DriverAdapter board with booster stage for 1200V IHM modules (130mm x 140mm). The IGBT module is to be ordered separately.·For connecting 1200V IHM IGBT Modules and driver boards

簡介

FF600R12KE3屬于分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊。由制造生產(chǎn)的FF600R12KE3晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導(dǎo)體器件，主要用作電子開關(guān)，兼具高效率和快速切換優(yōu)點(diǎn)。作為模塊，IGBT 配置為非對稱式橋； 升壓、降壓和制動斬波器；全橋、三電平和三相逆變器。有些器件內(nèi)置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進(jìn)行區(qū)分。