描述 Description

1200V PrimePACK?2 dual IGBT module with fast IGBT2 Fast, SiC Diodes for high frequency switching and NTC.

特性 Features

·Low Switching Losses
·V(cesat) with positive Temperature Coefficient
·4kV AC 1min Insulation
·Package with CTI > 400
·High Creepage and Clearance Distances
·Substrate for Low Thermal Resistance
·UL recognized

應用 Application

??This Module can be driven by the dedicated Evaluation Board.2ED250E12-FThis Module can be combined with the dedicated Evaluation Board.MA300E12Please select a matching HV Gate Driver IC from our EiceDRIVER? Portfolio.With Infineon EiceDRIVER? Enhanced and Compact Driver ICs as well as EiceDRIVER? Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.FF600R12IS4FData Sheet (1.9 MB, EN/CN)EN/DEEN/JAParametricFF600R12IS4FConfiguration?DualIC(nom) / IF(nom) ?600.0A?VCE(sat)(Tvj=25°C typ)?3.2V?VF(Tvj=25°C typ)?1.6V?Housing?PrimePACK? 2Dimensions(width)?89.0mm?Dimensions(length)?172.0mm?Data SheetTitleSizeDateVersionFF600R12IS4F (chinese/english)EN/CNEN/DEEN/JA1.9 MB10 十二月 201302_05Product BrochureTitleSizeDateVersion1EDI EiceDRIVER? Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用單極柵電壓驅(qū)動IGBTCNEN384 KB03 十一月 201501_00Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009電力電子模塊內(nèi)部NTC的使用CNEN586 KB26 十一月 2013Assembly Instructions PrimePACK? ModulesEN2.3 MB27 三月 201402_00PrimePACK? IGBT 模塊 的適配器板CNEN1.6 MB25 十一月 2013Evaluation Driver Board for 1200 V PrimePACK?EN1 MB14 二月 2011等效熱路模型CNEN500 KB25 十一月 2013如何正確計算并最大限度減小 IGBT 的死區(qū)時間CNEN1.5 MB26 八月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionIHM, IHV Modules & PrimePACK?EN452 KB27 四月 201608_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00Properties of a New PrimePACK? IGBT Module ConceptEN213 KB07 二月 2014Efficiency improvement with silicon carbide based power modulesEN275 KB31 一月 2011Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Wind Energy SystemsEN5.4 MB18 四月 2013Solutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for construction, commercial and agricultural vehicles (CAV)EN6.7 MB30 七月 2014Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Solutions for Traction SystemsEN2.9 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00銷售產(chǎn)品名稱FF600R12IS4FOPNFF600R12IS4FBOSA1產(chǎn)品狀態(tài)discontinued在線訂購封裝名稱AG-PRIME2-1無鉛產(chǎn)品no無鹵no通過無鉛認證yes包裝規(guī)格3包裝類型TRAY評估板評估板系列描述狀態(tài)MA300E12IGBT Modules, Gate DriverEvaluation Adapter board containing a booster stage for driving 1200V PrimePACK? in single or parallel configuration. ·For connecting 1200V PrimePACK? IGBT Modules and driver boards

簡介

FF600R12IS4F屬于分立半導體產(chǎn)品的晶體管-IGBT-模塊。由制造生產(chǎn)的FF600R12IS4F晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導體器件，主要用作電子開關，兼具高效率和快速切換優(yōu)點。作為模塊，IGBT 配置為非對稱式橋； 升壓、降壓和制動斬波器；全橋、三電平和三相逆變器。有些器件內(nèi)置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進行區(qū)分。