描述 Description

The FDMF5068 is ON Semiconductor’s next generation Smart Power Stage (SPS) solution with fully optimized, ultra?compact, integrated MOSFETs with advanced driver IC current and temperature sensors, for high?current, high frequency, and synchronous buck DC?DC converters.With an integrated approach, the SPS switching power stage is optimized for driver and MOSFET dynamic performance, system parasitic reduction, and power MOSFET RDS(ON).The integration of Power MOSFETs with a driver IC also enables high accuracy module?level thermal and current monitoring. The FDMF5068 provides an output signal (IMON), which reports the real?time module current. The IMON signal can be used to replace inductor DCR current sense or resistor sense methods. There is also accurate thermal monitoring (TMON) that provides a 0.8 V output at 25°C with an 8 mV/°C slope.

特性 Features

? Up to 70A Instantaneous Peak Current Handling Capability
? High Current Capability
? High-Performance, Universal Footprint, Copper-Clip 5 mm x 6 mm PQFN Package
? ON Semiconductor's PowerTrench? MOSFETs for Clean Voltage Waveforms and Reduced Ringing
? 30V / 25V Breakdown Voltage MOSFETs for Higher Long Term Reliability
? Optimized for Switching Frequencies up to 1 MHz
? Optimized FET Pair for Highest Efficiency at 10% ~ 15% Duty Cycle
? Integrated Temperature Monitoring (TMON)
? Integrated Current Monitoring (IMON)
? Catastrophic Fault Detection
? Thermal Flag (OTP) for Over-Temperature Condition
? Over-Current Protection Fault (OCP)
? High-Side Short Detect Fault
? BOOT Under Voltage (BOOT UV)
? ON Semiconductor Green Packaging and RoHS Compliance
? Dual Fault Pins (FAULT1, FAULT2) to Identifying a Faulting Phase in Multi-phase Applications

應(yīng)用 Application

? Telecom, Networking, Storage Voltage Regulators
? High-Current Multiphase Voltage Regulators
? Telecom, Networking, Storage ASICs
? DC/DC Power Module
? Artificial Intelligence Add-On Cards
? Telecom, Networking, Storage

簡介

FDMF5068屬于分立半導(dǎo)體產(chǎn)品的功率驅(qū)動(dòng)器模塊。由制造生產(chǎn)的FDMF5068功率驅(qū)動(dòng)器模塊功率驅(qū)動(dòng)器模塊為電源組件（通常為半橋或單相、兩相或三相配置的 IGBT 和 MOSFET）提供物理防護(hù)。功率半導(dǎo)體或裸片將焊接或燒結(jié)在基材上，后者可承載功率半導(dǎo)體并在需要時(shí)提供電和熱觸點(diǎn)以及電絕緣。功率模塊提供更高的功率密度，并且在許多情況下更可靠且更易于冷卻。