描述 Description

The FDMF5062 is ON Semiconductor’s next generation SmartPower Stage (SPS) solution with fully optimized, ultra?compact,integrated MOSFETs with advanced driver IC current and temperaturesensors, for high?current, high frequency, and synchronous buckDC?DC converters. With an integrated approach, the SPS switching power stage isoptimized for driver and MOSFET dynamic performance, systemparasitic reduction, and power MOSFET RDS(ON). The integration of Power MOSFETs with a driver IC also enableshigh accuracy module?level thermal and current monitoring. TheFDMF5062 provides an output signal (IMON), which reports thereal?time module current. The IMON signal can be used to replaceinductor DCR current sense or resistor sense methods. There is alsoaccurate thermal monitoring (TMON) that provides a 0.8 V output at25°C with an 8 mV/°C slope.

特性 Features

? Up to 70A Instantaneous Peak Current Handling Capability
? High-Performance, Universal Footprint, Copper-Clip 5 mm x 6 mm PQFN Package
? ON Semiconductor’s PowerTrench? MOSFETs for Clean Voltage Waveforms and Reduced Ringing
? 30 V / 25 V Breakdown Voltage MOSFETs for Higher Long-Term Reliability
? Optimized FET Pair for Highest Efficiency at 10% ~ 15 % Duty Cycle
? Optimized for Switching Frequencies up to 1 MHz
? Integrated Current Monitoring (IMON)
? Integrated Temperature Monitoring (TMON)
? Catastrophic Fault Detection Features
? Thermal Flag (OTP) for Over-Temperature Condition
? Over-Current Protection FAULT (OCP)
? High-Side Short Detect FAULT
? Under-Voltage Lockout (UVLO) on VCC and PVCC
? ON Semiconductor Green Packaging and RoHS Compliant

應(yīng)用 Application

CPU and Memory Voltage Regulators High-Current Multiphase Voltage Regulators Artificial Intelligence Add-On Cards Server CPUs, Storage, Telecom DC/DC Power Module

簡(jiǎn)介

FDMF5062屬于分立半導(dǎo)體產(chǎn)品的功率驅(qū)動(dòng)器模塊。由制造生產(chǎn)的FDMF5062功率驅(qū)動(dòng)器模塊功率驅(qū)動(dòng)器模塊為電源組件（通常為半橋或單相、兩相或三相配置的 IGBT 和 MOSFET）提供物理防護(hù)。功率半導(dǎo)體或裸片將焊接或燒結(jié)在基材上，后者可承載功率半導(dǎo)體并在需要時(shí)提供電和熱觸點(diǎn)以及電絕緣。功率模塊提供更高的功率密度，并且在許多情況下更可靠且更易于冷卻。