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Development Board for SMARC v2.0 RISC Module

Features ?? Supports SGeT SMARC v2.0 CPU module board ?? 4 kinds of display outputs. 18/24-bit LVDS or MIPI DSI, HDMI, DP ?? 1 x SATA/SATA-DOM, 2 x RJ-45, 1 x USB 3.0 Type C, 1 x USB 2.0 OTG, 1 x USB 3.0, 1 x USB 2.0, 2 x USB 2.0 Pin Headers, 2 x CAN bus, 4 x UART, 12 x GPIO ?? 3 x PCIe by 1

文件：432.45 Kbytes 頁數(shù)：2 Pages

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Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ?? NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ?? 1 x Arm Cortex-M4 core ?? Onboard 2GB LPDDR4 memory and eMMC 16GB ?? 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ?? 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera

文件：278.85 Kbytes 頁數(shù)：2 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? Wi-Fi: WPA/WPA2/WPA3 ? Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ? Supports Linux ? Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ? BT: LTE/MWS coexistence

文件：352.73 Kbytes 頁數(shù)：1 Pages

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802.11ac/a/b/g/n and BT 5.0 M.2 2230 Module

Features ? IEEE 802.11ac/a/b/g/n (2.4 and 5GHz) and Bluetooth 5.0 ? Supports MU-MIMO (2T2R) ? Wide operating temperature -30 ~ 85 °C (-22 ~ 185 °F) ? Supports Linux OS ? M.2 2230 form factor module (L x W x H) 30 x 22 x 2.85 mm/ 1.18 x .86 x .11 in

文件：385.5 Kbytes 頁數(shù)：1 Pages

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NXP i.MX8M Plus Cortex?-A53 2.5 SBC with UIO40-Express

Features ? NXP Arm? Cortex?-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz ? Onboard LPDDR4 4 GB/ 6 GB, 4000MT/s memory ? HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) ? 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. i

文件：3.95121 Mbytes 頁數(shù)：6 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 M.2 2830 E key Module

Features ? IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ? 2Tx/2Rx ? Wi-Fi: WPA/WPA2/WPA3 ? Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ? Supports Linux ? Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ? BT: LTE/MWS coexistence

文件：360.7 Kbytes 頁數(shù)：1 Pages

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802.11 a/b/g/n/ac Bluetooth 5.1 M.2 1216 solder down LGA type

Features ? IEEE 802.11 a/b/g/n/ac + Bluetooth 5.1 ? 2Tx/ 2Rx ? Up to 866.7 Mbps data rate ? Bluetooth 5.1 compliant with Bluetooth 2.1 + Enhanced Data Rate (EDR) ? Operating temperature: -30 ~ +85° C

文件：341.95 Kbytes 頁數(shù)：1 Pages

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MediaTek Genio 1200 Cortex A78 & A55 2.5 SBC with UIO40-Express

Features ? MediaTek Genio 1200 4 cores A78 & 4 cores A55 ? Onboard LPDDR4 8GB, 4000MT/s memory ? HDMI 4k60fps, 1 x Dual Channel 24 bit LVDS ? 1 x 4-wire RS-232/422/485, 2 x USB3.2 Gen1 By 1, 2 x USB2.0, 1 x Micro SD, 1 x Mic. in / Line out ? 1 x M.2 3052 Key B for 5G, 1 x M.2 2230 Key E Slot

文件：3.8938 Mbytes 頁數(shù)：6 Pages

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NXP i.MX8M Quad Core Cortex A53 High-Performance IoT Gateway with 2 x LAN, 2 x COM, 1 x USB

Features ? NXP i.MX8M Quad Core Cortex A53 1.3G CPU ? DDR4 2GB RAM, 16GB eMMC for system storage ? 2 x RS-232/485 isolated serial ports ? 2 x 10/100/1000 Ethernet ports ? 1 x Mini-PCIe for WIFI/Cellular/4G ? Support web service for remotely on-line monitoring ? Support SD card & on-line fir

文件：690.37 Kbytes 頁數(shù)：2 Pages

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802.11 ac/a/b/g/n Bluetooth 5.0 M.2 1216 (A-E Key) Card

Features ? IEEE 802.11 ac/a/b/g/n + Bluetooth 5.0 HS standard ? Support 802.11ac 2x2,Wave-2 compliant with MU-MIMO ? IEEE 802.11i (WPA, WPA2). Open, shared key, and pair-wise key authentication services ? Operating temperature: 0 ~ +70 °C

文件：346.94 Kbytes 頁數(shù)：1 Pages

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