描述 Description

This second series of SLLIMM (small low-loss intelligent molded module) nano provides a compact, high-performance AC motor drive in a simple, rugged design. It is composed of six improved short-circuit rugged trench gate fieldstop IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is designed to allow a better and more easily screwed-on heat sink, and is optimized for thermal performance and compactness in built-in motor applications or other low power applications where assembly space is limited. This IPM includes a completely uncommitted operational amplifier and a comparator that can be used to design a fast and efficient protection circuit.

特性 Features

? IPM 5 A, 600 V, 3-phase IGBT inverter bridge including 3 control ICs for gate driving and freewheeling diodes
? 3.3 V, 5 V, 15 V TTL/CMOS input comparators with hysteresis and pull-down/pull-up resistors
? Internal bootstrap diode
? Optimized for low electromagnetic interference
? Undervoltage lockout
? Short-circuit rugged TFS IGBTs
? Shutdown function
? Interlocking function
? Op-amp for advanced current sensing
? Comparator for fault protection against overcurrent
? NTC (UL 1434 CA 2 and 4)
? Up to ±2 kV ESD protection (HBM C = 100 pF, R = 1.5 kΩ)
? Isolation ratings of 1800 Vrms/min.
? UL recognition: UL 1557, file E81734

簡(jiǎn)介

STGIPQ5C60T-HZS屬于分立半導(dǎo)體產(chǎn)品的功率驅(qū)動(dòng)器模塊。由制造生產(chǎn)的STGIPQ5C60T-HZS功率驅(qū)動(dòng)器模塊功率驅(qū)動(dòng)器模塊為電源組件（通常為半橋或單相、兩相或三相配置的 IGBT 和 MOSFET）提供物理防護(hù)。功率半導(dǎo)體或裸片將焊接或燒結(jié)在基材上，后者可承載功率半導(dǎo)體并在需要時(shí)提供電和熱觸點(diǎn)以及電絕緣。功率模塊提供更高的功率密度，并且在許多情況下更可靠且更易于冷卻。