描述 Description

This intelligent power module implements a compact, high performance AC motor drive in a simple, rugged design. It is composed of six IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. This IPM includes an operational amplifier, completely uncommitted, and a comparator that can be used to design a fast and efficient protection circuit.

特性 Features

? IPM 3 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes
? Optimized for low electromagnetic interferences
? VCE(sat) negative temperature coefficient
? 3.3 V, 5 V, 15 V CMOS/TTL input comparators with hysteresis and pull-down/pull-up resistors
? Undervoltage lockout
? Internal bootstrap diode
? Interlocking function
? Optimized pinout for easy board layout
? 85 kΩ NTC for temperature control (UL1434 CA 2 and 4)

簡介

STGIPN3H60AT屬于分立半導(dǎo)體產(chǎn)品的功率驅(qū)動(dòng)器模塊。由制造生產(chǎn)的STGIPN3H60AT功率驅(qū)動(dòng)器模塊功率驅(qū)動(dòng)器模塊為電源組件（通常為半橋或單相、兩相或三相配置的 IGBT 和 MOSFET）提供物理防護(hù)。功率半導(dǎo)體或裸片將焊接或燒結(jié)在基材上，后者可承載功率半導(dǎo)體并在需要時(shí)提供電和熱觸點(diǎn)以及電絕緣。功率模塊提供更高的功率密度，并且在許多情況下更可靠且更易于冷卻。