FEATURES

? Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V

? Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V

? High speed data transfer rates with system frequency up to 933 MHz

? 8 internal banks for concurrent operation

? 8n-Bit pre-fetch architecture

? Programmable CAS Latency

? Programmable Additive Latency: 0, CL-1,CL-2

? Programmable CAS WRITE latency (CWL) based on tCK

? Programmable Burst Length: 4 and 8

? Programmable Burst Sequence: Sequential or Interleave

? BL switch on the fly

? Auto Self Refresh(ASR)

? Self Refresh Temperature(SRT)

? Refresh Interval:

7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C

3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C

? Partial Array Self Refresh

? Asynchronous RESET pin

? TDQS (Termination Data Strobe) supported (x8 only)

? OCD (Off-Chip Driver Impedance Adjustment)

? Dynamic ODT (On-Die Termination)

? Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)

? Write Leveling

? Up to 200 MHz in DLL off mode

? Operating temperature:

Commercial (TC = 0°C to +95°C)

Industrial (TC = -40°C to +95°C)

Automotive, A1 (TC = -40°C to +95°C)

Automotive, A2 (TC = -40°C to +105°C)