描述 Description

PrimePACK? 2?1200 V,?900 A half-bridge dual?IGBT module?with TRENCHSTOP? IGBT4, Emitter Controlled 4 Diode, NTC, fast switching chip and pre-applied Thermal Interface Material.

特性 Features

? Extended operation temperature Tvj op
? High DC stability
? High short circuit capability, self limiting short circuit current
? Low switching losses
? Unbeatable robustness
? VCEsatwith positive temperature coefficient
? 4 kV AC 1 min insulation
? Package with CTI > 400
? High creepage and clearance distances
? High power and thermal cycling capability
? Substrate for low thermal resistance
? UL recognized

優(yōu)勢:
? High power density
? Standardized housing

簡介

FF900R12IE4P屬于分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊。由制造生產(chǎn)的FF900R12IE4P晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導(dǎo)體器件，主要用作電子開關(guān)，兼具高效率和快速切換優(yōu)點。作為模塊，IGBT 配置為非對稱式橋； 升壓、降壓和制動斬波器；全橋、三電平和三相逆變器。有些器件內(nèi)置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進行區(qū)分。