描述 Description

The quad T1 and E1 transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 single-chip transceivers and the DS21354/DS21554 E1 single-chip transceivers. Four silicon die of one of these devices is packaged in a multi-chip module (MCM) with the electrical connections as shown in Figure 1 in the data sheet. All of the functions available on the DS21352/DS21552 and DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package size, some signals have been deleted. These differences are detailed in table 1 in the data sheet.
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the operating characteristics of the device.

特性 Features

? Four completely independent T1 or E1 transceivers in one small 27mm x 27mm package
? Each transceiver contains a short and long haul line interface plus a full featured framer with alarm detection/generation, elastic-stores, hardware based signaling support, per DS0 channel control and HDLC controller
? Each multi-chip module (MCM) contains four die of
? DS21352 (DS21Q352)
? DS21552 (DS21Q552)
? DS21354 (DS21Q354)
? DS21554 (DS21Q554)
? See the specific DS21352/DS21552 and DS21354/DS21554 data sheets for details on their feature set and operation
? All four T1 or E1 transceivers can be concatenated into a single 8.192MHz backplane data stream
? IEEE 1149.1 JTAG-Boundary Scan architecture
? DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are pin compatible to allow the same footprint to support T1 and E1 applications
? 256-pin MCM BGA package (27mm X 27mm)
? Low power 5V CMOS or low power 3.3V CMOS with 5V tolerant input and outputs

簡介

DS21Q552屬于集成電路（IC）的電信。由制造生產(chǎn)的DS21Q552電信電信接口集成電路 (IC) 為通信網(wǎng)絡(luò)接口提供特定功能和控制，例如以太網(wǎng)切換、線路驅(qū)動器、ISDN、放大器、通道擴(kuò)展器、數(shù)字鎖相環(huán)、DTMF、音頻發(fā)生器和解碼器、回聲消除、檢測器和發(fā)生器、DDA、電話線路監(jiān)控器和主叫號碼標(biāo)識。