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首頁>6125TD2.5-R>芯片詳情
6125TD2.5-R_BUSSMANN/伊頓_Fuse Chip 2.5A 125V Slow Blow 2-Pin Solder Pad Surface Mount T/R正邁科技
- 詳細(xì)信息
- 規(guī)格書下載
產(chǎn)品屬性
- 類型
描述
- 型號:
6125TD2.5-R
- 制造商:
COOPER BUSSMANN
- 功能描述:
Fuse Chip 2.5A 125V Slow Blow 2-Pin Solder Pad Surface Mount T/R
供應(yīng)商
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