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UPC8106TB-E3

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION TheμPC8106TBandμPC8109TBaresiliconmonolithicintegratedcircuitdesignedasfrequencyup-converterforcellular/cordlesstelephonetransmitterstage.TheμPC8106TBfeaturesimprovedintermodulationandμPC8109TBfeatureslowcurrentconsumption.Fromthesetwoversion,youcanc

UPC8106TB-E3

絲印：C2D；BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ?Recommendedoperatingfrequency:fRFout=0.4to2.0GHz,fIFin=100to400MHz ?Supplyvoltage:VCC=2.7to5.5V ?High-densitysurfacemounting:6-pinsuperminimoldpackage ?Lowcurrentconsumption:ICC=9mATYP.@mPC8106TB ICC=5mATYP.@mPC8109TB ?Minimizedca

UPC8106TB-E3

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES; ? Recommended operating frequency : fRFout = 0.4 GHz to 2.0 GHz, fIFin = 100 MHz to 400 MHz\n? Supply voltage : VCC = 2.7 to 5.5 V\n? High-density surface mounting : 6-pin super minimold package\n? Low current consumption : ICC = 9 mA TYP. @ μPC8106TB\n????????????????????????????????? ??? ICC = 5 mA TYP. @ μPC8109TB\n? Minimized carrier leakage : Due to double balanced mixer\n? Built-in power save functionAPPLICATION\n? Cellular/cordless telephone up to 2.0 GHz MAX (example: PHS, PDC, DCS1800 and so on)?;

DESCRIPTION\nThe μPC8106TB and μPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The μPC8106TB features improved intermodulation and μPC8109TB features low current consumption. From these two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size.\nThe μPC8106TB and μPC8109TB are manufactured using NEC’s 20 GHz fT NESATTMIII silicon bipolar process. This process uses a silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.FEATURES\n? Recommended operating frequency : fRFout = 0.4 GHz to 2.0 GHz, fIFin = 100 MHz to 400 MHz\n? Supply voltage : VCC = 2.7 to 5.5 V\n? High-density surface mounting : 6-pin super minimold package\n? Low current consumption : ICC = 9 mA TYP. @ μPC8106TB\n????????????????????????????????? ??? ICC = 5 mA TYP. @ μPC8109TB\n? Minimized carrier leakage : Due to double balanced mixer\n? Built-in power save functionAPPLICATION\n? Cellular/cordless telephone up to 2.0 GHz MAX (example: PHS, PDC, DCS1800 and so on)

UPC8106TB-E3-A

3 V SILICON RFIC FREQUENCY UPCONVERTER; ? RECOMMENDED OPERATING FREQUENCY:\n?? fRFout = 0.4 GHz to 2.0 GHz\n?? fIFin = 100 MHz to 400 MHz\n? SUPPLY VOLTAGE:\n?? VCC = 2.7 to 5.5 V\n? HIGH DENSITY SURFACE MOUNTING:\n?? 6 pin super mini mold package\n? LOW CARRIER LEAKAGE:\n?? Due to double balanced mixer\n? BUILT-IN POWER SAVE FUNCTIONAPPLICATION\n? CELLULAR/CORDLESS TELEPHONE?;

DESCRIPTION\nNEC's UPC8106TB is a silicon RFIC designed as a frequency upconverter for cellular/cordless telephone transmitter stages and features improved intermodulation. This device is housed in a 6 pin super mini mold or SOT-363 package making it ideal for reducing system size. The UPC8106TB is manufactured using NEC's 20 GHz fT NESAT? III silicon bipolar process.\nNEC's stringent quality assurance and test procedures ensure the highest reliability and performance.FEATURES\n? RECOMMENDED OPERATING FREQUENCY:\n?? fRFout = 0.4 GHz to 2.0 GHz\n?? fIFin = 100 MHz to 400 MHz\n? SUPPLY VOLTAGE:\n?? VCC = 2.7 to 5.5 V\n? HIGH DENSITY SURFACE MOUNTING:\n?? 6 pin super mini mold package\n? LOW CARRIER LEAKAGE:\n?? Due to double balanced mixer\n? BUILT-IN POWER SAVE FUNCTIONAPPLICATION\n? CELLULAR/CORDLESS TELEPHONE

UPC8106TB-E3-A

3 V SILICON RFIC FREQUENCY UPCONVERTER

UPC8106TB-E3-A

Package：6-TSSOP，SC-88，SOT-363；包裝：散裝 類別：RF/IF，射頻/中頻和 RFID 射頻混頻器 描述：IC MIXER 400MHZ-2.5GHZ UP 6SMINI