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TEC14MEV1.0中文資料ANALOGTECHNOLOGIES數(shù)據(jù)手冊PDF規(guī)格書

TEC14MEV1.0
廠商型號

TEC14MEV1.0

功能描述

Evaluation Board for TEC Controllers

文件大小

1.21452 Mbytes

頁面數(shù)量

8

生產(chǎn)廠商 Analog Technologies, Inc.
企業(yè)簡稱

ANALOGTECHNOLOGIES

中文名稱

Analog Technologies, Inc.官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二

更新時間

2025-7-20 15:01:00

人工找貨

TEC14MEV1.0價格和庫存,歡迎聯(lián)系客服免費人工找貨

TEC14MEV1.0規(guī)格書詳情

BOARD DESCRIPTION

The TEC controller evaluation board TEC14MEV1.0 is

consisted of a complete tuning and application circuit for

driving a TEC. It can set the output voltage limit, tune the

compensation network, set internal operating temperature

point, and has an LED for indicating the temperature status of

the controller, and has numerous connection pads for making

connections with external components and instruments. Its

photo is shown in Figure 1. The TEC control module is

located on the lower right of the TEC14MEV1.0 evaluation

board. The voltages of all its pins can be measured directly by

probing the vias on the left and right side of the module

sockets which are connected directly with pins of the

electronic module. Some of the pins are also connected to the

soldering pads with two vias on the edges of the board. The

names of all these nodes are marked on the board.

The silkscreen layer of the evaluation board is shown in Figure

2 with other top layers, including top silkscreen, top copper,

top solder mask, and multilayer (vias). Figure 3 only shows

the image of top silkscreen layer. There is no component in the

bottom side of the board, so that there is no bottom silkscreen

layer image.

There are solder pads on the left and right edges of the board.

These pads can be used for connecting the external

instruments or components with and the connections can be

made by soldering wires, clipping by alligator clips or probing

by probes. See Figure 1, 2 and 3. There are solder pads also on

the top and the lower side center of the board. These pads can

be used for connecting the external instruments or components

and the connections can be made by probing with probes or

soldering wires.

On the top of the board, there is a switch bank. A

potentiometer is located on the lower side the switch bank. On

the bottom of the board, there are 5 switch banks. When the

set-point temperature and the actual target temperature are less

than 0.1°C in difference, the LED on the top lower location

will be lit up.

On the board, the compensation network has been initialized

before the ship. The initial values of these parameters are

shown in table 1.

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