1 Features / Description

HybridPACK? Drive module with EDT2 IGBT and Diode

Electrical Features

?Blocking voltage 750V

?Low VCEsat

?Low Switching Losses

?Low Qg and Crss

?Low Inductive Design

?Tvj op = 150°C

?Short-time extended Operation Temperature

Tvj op = 175°C

Mechanical Features

?4.2kV DC 1sec Insulation

?High Creepage and Clearance Distances

?Compact design

?High Power Density

?Direct Cooled PinFin Base Plate

?Guiding elements for PCB and cooler assembly

?Integrated NTC temperature sensor

?PressFIT Contact Technology

?RoHS compliant

?UL 94 V0 module frame

描述 Description

The HybridPACKTM Drive is a very compact

six-pack module (750V/820A) optimized for hybrid

and electric vehicles. The power module

implements the new EDT2 IGBT generation, which

is an automotive Micro-Pattern Trench-Field-Stop

cell design optimized for electric drive train

applications. The chipset has benchmark current

density combined with short circuit ruggedness and

increased blocking voltage for reliable inverter

operation under harsh environmental conditions.

The EDT2 IGBTs also show excellent light load

power losses, which helps to improve system

efficiency over a real driving cycle. The EDT2 IGBT

was optimized for applications with switching

frequencies in the range of 10 kHz.

The new HybridPACKTM Drive power module family

comes with mechanical guiding elements

supporting easy assembly processes for customers.

Furthermore, the press-fit pins for the signal

terminals avoid additional time consuming selective

solder processes, which provides cost savings on

system level and increases system reliability. The

direct cooled baseplate with PinFin structure in the

FS820R08A6P2B product best utilizes the

implemented chipset and shows superior thermal

characteristics. Due to the high clearance &

creepage distances, the module family is also well

suited for increased system working voltages and

supports modular inverter approaches.