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首頁>SN74LVC2G00DCUTG4.B>規(guī)格書詳情

SN74LVC2G00DCUTG4.B中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

SN74LVC2G00DCUTG4.B
廠商型號

SN74LVC2G00DCUTG4.B

功能描述

SN74LVC2G00 Dual 2-Input Positive-NAND Gate

絲印標(biāo)識

C00R

封裝外殼

VSSOP

文件大小

714.69 Kbytes

頁面數(shù)量

26

生產(chǎn)廠商 Texas Instruments
企業(yè)簡稱

TI2德州儀器

中文名稱

美國德州儀器公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-8-4 11:01:00

人工找貨

SN74LVC2G00DCUTG4.B價(jià)格和庫存,歡迎聯(lián)系客服免費(fèi)人工找貨

SN74LVC2G00DCUTG4.B規(guī)格書詳情

1 Features

1? Available in the Texas Instruments

NanoFree? Package

? Supports 5-V VCC Operation

? Inputs Accept Voltages to 5.5 V

? Max tpd of 4.3 ns at 3.3 V

? Low Power Consumption, 10-μA Max I CC

? ±24-mA Output Drive at 3.3 V

? Typical V OLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

? Typical VOHV (Output VOH Undershoot)

> 2 V at VCC = 3.3 V, TA = 25°C

? Ioff Supports Live Insertion, Partial Power

Down Mode, and Back Drive Protection

? Latch-Up Performance Exceeds 100 mA

Per JESD 78, Class II

? ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model

– 1000-V Charged-Device Model

2 Applications

? IP Phones: Wired and Wireless

? Optical Modules

? Optical Networking: EPON and Video Over Fiber

? Point-to-Point Microwave Backhaul

? Power: Telecom DC/DC Module:

Analog and Digital

? Private Branch Exchanges (PBX)

? TETRA Base Exchanges

? Telecom Base Band Units

? Telecom Shelters: Power Distribution Units (PDU),

Power Monitoring Units (PMU), Wireless Battery

Monitoring, Remote Electrical Tilt Units (RET),

Remote Radio Units (RRU), Tower Mounted

Amplifiers (TMA)

? Vector Signal Analyzers and Generators

? Video Conferencing: IP-Based HD

? WiMAX and Wireless Infrastructure Equipment

? Wireless Communications Testers and

Wireless Repeaters

? xDSL Modems and DSLAM

3 Description

This dual 2-input positive-NAND gate is designed for

1.65-V to 5.5-V VCC operation.

The SN74LVC2G00 device performs the Boolean

function Y = A × B or Y = A + B in positive logic.

NanoFree? package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

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