SN74LVC1G99DCURG4屬于集成電路（IC）的門反相器-多功能可配置。由美國德州儀器公司制造生產(chǎn)的SN74LVC1G99DCURG4門和反相器 - 多功能，可配置可配置邏輯柵極系列產(chǎn)品能以與標(biāo)準(zhǔn)邏輯柵極類似的方式，對單個邏輯信號執(zhí)行基本邏輯運算，但并非局限于一個特定功能（例如 AND、NAND 等）。它們通常在內(nèi)部使用少量邏輯門來實現(xiàn)，經(jīng)過選擇和互連后，以便通過選擇操作數(shù)據(jù)所應(yīng)用的輸入以及任何未使用的輸入在驅(qū)動后的邏輯狀態(tài)，來配置所實現(xiàn)的整體邏輯功能。

1FEATURES

2? Available in Texas Instruments

NanoFree? Package

? Supports 5-V VCC Operation

? Inputs Accept Voltages to 5.5 V

? Supports Down Translation to VCC

? Max tpd of 6.7 ns at 3.3 V

? Low Power Consumption, 10-μA Max I CC

? ±24-mA Output Drive at 3.3 V

? Offers Nine Different Logic Functions in a

Single Package

? Ioff Supports Live Insertion, Partial-Power-

Down Mode, and Back-Drive Protection

? Input Hysteresis Allows for Slow Input

Transition Time and Better Noise Immunity at

Input

? Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

? ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION

The SN74LVC1G99 device is operational from 1.65 V

to 5.5 V.

The SN74LVC1G99 device features configurable

multiple functions with a 3-state output. The output is disabled when the output-enable (OE) input is high.

When OE is low, the output state is determined by 16

patterns of 4-bit input. The user can choose logic

functions, such as MUX, AND, OR, NAND, NOR,

XOR, XNOR, inverter, and buffer. All inputs can be

connected to VCC or GND.

This device functions as an independent inverter, but

because of Schmitt action, it has different input

threshold levels for positive-going (VT+) and negative-

going (VT–) signals.

To ensure the high-impedance state during power up

or power down, OE should be tied to VCC through a

pullup resistor; the minimum value of the resistor is

determined by the current-sinking capability of the

driver.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

NanoFree? package technologies are a major

breakthrough in IC packaging concepts, using the die

as the package.