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首頁(yè)>SN74AUC1G79DCKR.B>規(guī)格書(shū)詳情

SN74AUC1G79DCKR.B中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

SN74AUC1G79DCKR.B
廠(chǎng)商型號(hào)

SN74AUC1G79DCKR.B

功能描述

SN74AUC1G79 Single Positive-Edge-Triggered D-type Flip-Flop

絲印標(biāo)識(shí)

UR5

封裝外殼

SC70

文件大小

612.63 Kbytes

頁(yè)面數(shù)量

19 頁(yè)

生產(chǎn)廠(chǎng)商 Texas Instruments
企業(yè)簡(jiǎn)稱(chēng)

TI2德州儀器

中文名稱(chēng)

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原廠(chǎng)標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

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更新時(shí)間

2025-8-1 16:06:00

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SN74AUC1G79DCKR.B規(guī)格書(shū)詳情

1 Features

1? Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

? ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

? Available in the Texas Instruments NanoFree?

Package

? Optimized for 1.8-V Operation and Is 3.6-V I/O

Tolerant to Support Mixed-Mode Signal Operation

? Ioff Supports Partial-Power-Down Mode Operation

? Sub-1-V Operable

? Max tpd of 1.9 ns at 1.8 V

? Low Power Consumption, 10-μA Maximum ICC

? ±8-mA Output Drive at 1.8 V

2 Applications

? AV Receiver

? Audio Dock: Portable

? Blu-Ray Player and Home Theater

? Embedded PC

? MP3 Player/Recorder (Portable Audio)

? Personal Digital Assistant (PDA)

? Power: Telecom/Server AC/DC Supply: Single

Controller: Analog and Digital

? Solid State Drive (SSD): Client and Enterprise

? TV: LCD/Digital and High-Definition (HDTV)

? Tablet: Enterprise

? Video Analytics: Server

? Wireless Headset, Keyboard, and Mouse

3 Description

This single positive-edge-triggered D-type flip-flop is

operational at 0.8-V to 2.7-V VCC, but is designed

specifically for 1.65-V to 1.95-V VCC operation.

When data at the data (D) input meets the setup time

requirement, the data is transferred to the Q output

on the positive-going edge of the clock pulse. Clock

triggering occurs at a voltage level and is not directly

related to the rise time of the clock pulse. Following

the hold-time interval, data at the D input can be

changed without affecting the levels at the outputs.

NanoFree? package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

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