FEATURES

? 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01

? Excellent clamping capability

? Low incremental surge resistance

? Typical IR less than 1μA when VBR min>12V

? For surface mounted applications to optimize board space

? Low profle package

? Built-in strain relief

? Typical failure mode is short from over-specifed voltage or current

? Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

? IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)

? ESD protection of data lines in accordance with IEC 61000-4-2

? EFT protection of data lines in accordance with IEC 61000-4-4

? Fast response time: typically less than 1.0ps from 0V to BV min

? Glass passivated chip junction

? High temperature to reflow soldering guaranteed: 260°C/40sec

? VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coeffcient, typical value is 0.1)

? Plastic package is flammability rated V-0 per Underwriters Laboratories

? Meet MSL level1, per J-STD-020, LF maximun peak of 260°C

? Matte tin lead–free plated

? RoHS compliant

? Pb-free E3 means 2nd level interconnect is Pb-free and the terminal fnish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)