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SLC37PDZXXX數(shù)據(jù)手冊(cè)Infineon中文資料規(guī)格書

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廠商型號(hào)

SLC37PDZXXX

功能描述

40nm SLC3x products enhance user experience for excellent performance and flexibility

制造商

Infineon Infineon Technologies AG

中文名稱

英飛凌 英飛凌科技股份公司

數(shù)據(jù)手冊(cè)

下載地址下載地址二

更新時(shí)間

2025-8-19 15:15:00

人工找貨

SLC37PDZXXX價(jià)格和庫存,歡迎聯(lián)系客服免費(fèi)人工找貨

SLC37PDZXXX規(guī)格書詳情

特性 Features


優(yōu)勢(shì):
? Optimize time-to-market: Customers can benefit from fastest design-in of the SLC36PDx 40nm product series, as it supports wide range of applications from the smallest to most powerful chip in the market. R&D resources can be optimized.
? Excellence in converging markets: The state of the art Arm? SecurCore? SC300 chip architecture of the 40nm SLC36PDx product series enables a CL boost performance for high demanding payment and multi-application uses cases.
? Best fit for all regional variances: The product offering is designed for global markets and support specific regional market requirements. The excellent Infineon customer support within the regional organization around the globe enables a very fast time to market.
? Innovations platform: The 40nm platform and its enhanced feature enables innovations, including market trends such as biometric authentication. Innovative ready to use delivery forms such as the SPA modules enable very fast design of new form factors within a few weeks.

應(yīng)用 Application

? Payment
? Transport
? Identification

技術(shù)參數(shù)

  • 制造商編號(hào)

    :SLC37PDZXXX

  • 生產(chǎn)廠家

    :Infineon

  • Leading Technologies

    :SOLID FLASH?/Coil on Module

  • Applications

    :wearables payment /multiapplication

  • Interfaces

    :ISO 7816/ISO 14443 A/B/ISO 18092 passive mode

  • NVM/ 凌捷掩膜 min

    :400 kByte

  • NVM/ 凌捷掩膜 max

    :512 kByte

  • RAM

    :14 kByte

  • CPU

    :32-bit Arm? SecurCore? SC300

  • Symmetric Cryptography

    :AES up to 256-bit/DES

  • Asymmetric Cryptography

    :ECC up to 521-bit/RSA up to 4096-bit

  • Ambient Temperature min

    :-25 °C

  • Ambient Temperature max

    :85 °C

  • Delivery Forms

    :Coil on Module/ sawn wafer/6/8 pin dual-interface modules and contactless modules

  • Certifications

    :CC EAL6+ high targeted/CUP (targeted)/EMVCo (targeted)

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