SKY66002-11-EVB屬于開發(fā)板套件編程器的射頻評(píng)估開發(fā)套件開發(fā)板。由美國思佳訊公司制造生產(chǎn)的SKY66002-11-EVB射頻評(píng)估和開發(fā)套件，開發(fā)板本系列中的產(chǎn)品適用于在已知實(shí)施環(huán)境中，提供能訪問射頻相關(guān)器件的功能或者有助于訪問該功能。所含的焦點(diǎn)產(chǎn)品范圍從射頻信號(hào)鏈元器件（如放大器和檢測(cè)器）到模塊化收發(fā)器，以及不直接包含焦點(diǎn)產(chǎn)品的適配器硬件，但此類硬件可供方便地訪問用戶單獨(dú)提供的特定射頻產(chǎn)品或系列。

Applications

? Residential femtocells

? WCDMA, Band 2

? Small cells

特性 Features

? Small signal gain: 29 dB

? ACLR at POUT = +19 dBm: -50 dBc

? PA on/off control

? I/O impedance internally matched to 50 Ω

? Single DC supply: 3.3 V to 4.6 V

? Minimal number of external components required

? Small footprint MCM (10-pin, 3 x 3 mm) package

(MSL3, 260 °C per JEDEC J-STD-020)

描述 Description

The SKY66002-11 linear power amplifier (PA) is a fully

matched surface-mount module developed for WCDMA

applications operating from 1900 to 2025 MHz. The device

meets the stringent spectral linearity requirements of

WCDMA femtocell applications with high power-added

efficiency. An integrated directional coupler eliminates the

need for any external coupler.

The GaAs MMIC contains all active amplifier circuitry, which

includes input and interstage matching circuits. An output

match into a 50 Ω load, realized off-chip within the module

package, optimizes efficiency and power performance.

The SKY66002-11 is manufactured with Skyworks InGaP

GaAs HBT process, which provides for all positive voltage

DC supply operation and maintains high efficiency and good

linearity. The primary bias to the device can be supplied

directly from any suitable power supply with an output of

4.2 V. Power down is achieved by setting the VEN pin to 0 V.

No external supply side switch is needed since typical “off”

leakage is a few microamps with full primary voltage

supplied from the main power supply.

The SKY66002-11 is packaged in a 10-pin, 3 x 3 mm Multi-

Chip Module (MCM), which allows for a highly

manufacturable low-cost solution.

A functional block diagram of the SKY66002-11 is shown in

Figure 1. The 10-pin MCM package and pinout are shown in

Figure 2. Signal pin assignments and functional pin

descriptions are provided in Table 1.