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首頁 >SKKD26/08>規(guī)格書列表

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IRKT26/08A

ADD-A-pak-TMGENVPowerModules

IRF

International Rectifier

IRKT26/08A

ADD-A-pakTMGENVPowerModules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRF

International Rectifier

SKB26/08

PowerBridgeRectifiers

SemikronSemikron International

賽米控丹佛斯

SKB26/08

PowerBridgeRectifiers

SemikronSemikron International

賽米控丹佛斯

SKDI26/08

3~phase

SemikronSemikron International

賽米控丹佛斯

VS-VSKH26/08

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

VS-VSKL26/08

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

VS-VSKN26/08

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

VS-VSKT26/08

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

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