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PBSS4330PA

絲?。?a target="_blank" title="Marking" href="/ah/marking.html">AH;Package:DFN2020-3;30 V, 3 A NPN low VCEsat (BISS) transistor

1.Generaldescription NPNlowVCEsatBreakthroughInSmallSignal(BISS)transistor,encapsulatedinan ultrathinSOT1061leadlesssmallSurface-MountedDevice(SMD)plasticpackagewith mediumpowercapability. PNPcomplement:PBSS5330PA. 2.Featuresandbenefits ?Lowcollector-emitter

NEXPERIANexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PA

30 V, 3 A NPN low VCEsat (BISS) transistor; ? Low collector-emitter saturation voltage VCEsat\n? High collector current capability IC and ICM\n? Smaller required Printed-Circuit Board (PCB) area than for conventional transistors\n? Exposed heat sink for excellent thermal and electrical conductivity\n? Leadless small SMD plastic package with medium power capability\n;

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.\n PNP complement: PBSS5330PA.\n

NexperiaNexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PA

30 V, 3 A NPN low VCEsat (BISS) transistor

PHIPhilips Semiconductors

飛利浦荷蘭皇家飛利浦

PHI

PBSS4330PAS

絲印:E1;Package:DFN2020D-3;30 V, 3 A NPN low VCEsat (BISS) transistor

Generaldescription NPNlowVCEsatBreakthroughInSmallSignal(BISS)transistor,encapsulatedinanultrathinDFN2020D-3(SOT1061D)leadlesssmallSurface-MountedDevice(SMD)plasticpackagewithmediumpowercapabilityandvisibleandsoldarablesidepads. PNPcomplement:PBSS5330PAS Featu

NEXPERIANexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PAS

30 V, 3 A NPN low VCEsat (BISS) transistor; ? Low collector-emitter saturation voltage VCEsat\n? High collector current capability IC and ICM\n? High collector current gain (hFE) at high IC\n? High efficiency due to less heat generation\n? High temperature applications up to 175 °C\n? Reduced Printed-Circuit Board (PCB) area requirements\n? Leadless small SMD plastic package with soldarable side pads\n? Exposed heat sink for excellent thermal and electrical conductivity\n? Suitable for Automatic Optical Inspection (AOI) of solder joint\n? AEC-Q101 qualified\n;

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.\n PNP complement: PBSS5330PAS\n

NexperiaNexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PAS-Q

30 V, 3 A NPN low VCEsat transistor; ? Low collector-emitter saturation voltage VCEsat\n? High collector current capability IC and ICM\n? High collector current gain (hFE) at high IC\n? High efficiency due to less heat generation\n? High temperature applications up to 175 °C\n? Reduced Printed-Circuit Board (PCB) area requirements\n? Leadless small SMD plastic package with soldarable side pads\n? Exposed heat sink for excellent thermal and electrical conductivity\n? Suitable for Automatic Optical Inspection (AOI) of solder joint\n? Qualified according to AEC-Q101 and recommended for use in automotive applications\n;

NPN low VCEsat transistor encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.\n PNP complement: PBSS5330PAS\n

NexperiaNexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PAS-Q

絲?。?a target="_blank" title="Marking" href="/e1/marking.html">E1;Package:DFN2020D-3;30 V, 3 A NPN low VCEsat transistor

1.Generaldescription NPNlowVCEsattransistorencapsulatedinanultrathinDFN2020D-3(SOT1061D)leadlesssmall Surface-MountedDevice(SMD)plasticpackagewithmediumpowercapabilityandvisibleand soldarablesidepads. PNPcomplement:PBSS5330PAS 2.Featuresandbenefits ?Lowcol

NEXPERIANexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

PBSS4330PA_15

30 V, 3 A NPN low VCEsat (BISS) transistor

PHIPhilips Semiconductors

飛利浦荷蘭皇家飛利浦

PHI

PBSS4330PAS_15

30 V, 3 A NPN low VCEsat (BISS) transistor

PHIPhilips Semiconductors

飛利浦荷蘭皇家飛利浦

PHI

PBSS4330PA,115

Package:3-PowerUDFN;包裝:卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶 類別:分立半導體產(chǎn)品 晶體管 - 雙極性晶體管(BJT)- 單個 描述:TRANS NPN 30V 3A 3HUSON

ETC

ETC

技術參數(shù)

  • Package name:

    DFN2020-3

  • Size (mm):

    2 x 2 x 0.65

  • Polarity:

    NPN

  • Ptot (mW):

    500

  • VCEO [max] (V):

    30

  • IC [max] (mA):

    3000

  • hFE [min]:

    300

  • hFE [max]:

    700

  • Tj [max] (°C):

    150

  • fT [min] (MHz):

    100

  • Automotive qualified:

    N

供應商型號品牌批號封裝庫存備注價格
恩XP
24+
標準封裝
22048
全新原裝正品/價格優(yōu)惠/質(zhì)量保障
詢價
恩XP
2021+
SOT-1061-3
9000
原裝現(xiàn)貨,隨時歡迎詢價
詢價
恩XP
18+
SOT-1061-3
18000
詢價
恩XP
18+
SOT-1061-3
18000
詢價
恩XP
2016+
SOT1061
6523
房間原裝進口現(xiàn)貨假一賠十
詢價
恩XP
2020+
SOT1061
3000
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
詢價
NEXPERIA/安世
2447
SOT1061
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
詢價
恩XP
23+
NA
20094
正納10年以上分銷經(jīng)驗原裝進口正品做服務做口碑有支持
詢價
NEXPERIA/安世
23+
NA
9000
原裝正品假一罰百!可開增票!
詢價
恩XP
23+
SOT1061
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢價
更多PBSS4330PA供應商 更新時間2025-7-30 9:38:00