最新无码a∨在线观看,一本av高清一区二区三区,亚洲熟妇色l20p,宅男噜噜69av,中出あ人妻熟女中文字幕

首頁>OMAP5910>規(guī)格書詳情

OMAP5910數(shù)據(jù)手冊集成電路(IC)的微處理器規(guī)格書PDF

PDF無圖
廠商型號

OMAP5910

參數(shù)屬性

OMAP5910 封裝/外殼為289-BGA;包裝為管件;類別為集成電路(IC)的微處理器;產(chǎn)品描述:IC MPU OMAP-59XX 150MHZ 289BGA

功能描述

應(yīng)用處理器

封裝外殼

289-BGA

制造商

TI Texas Instruments

中文名稱

德州儀器 美國德州儀器公司

數(shù)據(jù)手冊

下載地址下載地址二

更新時間

2025-8-6 17:11:00

人工找貨

OMAP5910價格和庫存,歡迎聯(lián)系客服免費人工找貨

OMAP5910規(guī)格書詳情

描述 Description

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP? platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS? software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth? wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows? Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP? platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS? software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth? wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows? Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

特性 Features

? Low-Power, High-Performance CMOS Technology
? 0.13-μm Technology
? 1.6-V Core Voltage

? TI925T (MPU) ARM9TDMI? Core
? Support 32-Bit and 16-Bit (Thumb? Mode) Instruction Sets
? 16K-Byte Instruction Cache
? 8K-Byte Data Cache
? Data and Program Memory Management Units (MMUs)
? Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
? 17-Word Write Buffer

? TMS320C55x? (C55x?) DSP Core
? One/Two Instructions Executed per Cycle
? Dual Multipliers (Two Multiply-Accumulates per Cycle)
? Two Arithmetic/Logic Units
? One Internal Program Bus
? Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
? 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
? 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
? 16K x 16-Bit On-Chip ROM (32K Bytes)
? Instruction Cache (24K Bytes)
? Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression

? 192K Bytes of Shared Internal SRAM
? Memory Traffic Controller (TC)
? 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
? 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM

? 9-Channel System DMA Controller
? DSP Memory Management Unit
? Endianism Conversion Logic
? Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
? DSP Peripherals
? Three 32-Bit Timers and Watchdog Timer
? Level1/Level2 Interrupt Handlers
? Six-Channel DMA Controller
? Two Multichannel Buffered Serial Ports
? Two Multichannel Serial Interfaces

? TI925T Peripherals
? Three 32-Bit Timers and Watchdog Timer
? 32-kHz Timer
? Level1/Level2 Interrupt Handlers
? USB (Full/Low Speed) Host Interface With up to 3 Ports
? USB (Full Speed) Function Interface
? One Integrated USB Transceiver for Either Host or Function
? Multichannel Buffered Serial Port
? Inter-Integrated Circuit (I2C) Master and Slave Interface
? Microwire? Serial Interface
? Multimedia Card (MMC) and Secure Digital (SD) Interface
? HDQ/1-Wire? Interface
? Camera Interface for CMOS Sensors
? ETM9 Trace Module for TI925T Debug
? Keyboard Matrix Interface (6 x 5 or 8 x 8)
? Up to Ten MPU General-Purpose I/Os
? Pulse-Width Tone (PWT) Interface
? Pulse-Width Light (PWL) Interface
? Two LED Pulse Generators (LPGs)
? Real-Time Clock (RTC)
? LCD Controller With Dedicated System DMA Channel

? Shared Peripherals
? Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
? Four Interprocessor Mailboxes
? Up to 14 Shared General-Purpose I/Os

? Individual Power-Saving Modes for MPU/DSP/TC
? On-Chip Scan-Based Emulation Logic
? IEEE Std 1149.1 (JTAG) Boundary Scan Logic
? Two 289-Ball MicroStar BGA? (Ball Grid Array) Package Options (GZG and GDY Suffixes)
TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments. ARM9TDMI is a trademark of ARM Limited. Thumb is a registered trademark of ARM Limited. Microwire is a trademark of National Semiconductor Corporation. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. OMAP and DSP/BIOS are trademarks of Texas Instruments. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation. Other trademarks are the property of their respective owners.

技術(shù)參數(shù)

  • 制造商編號

    :OMAP5910

  • 生產(chǎn)廠家

    :TI

  • Arm MHz (Max.)

    :192

  • Co-processor(s)

    :C55x DSP

  • CPU

    :32-bit

  • Hardware accelerators

    :Video Hardware Accelerators for DCT/iDCT

  • Operating system

    :Linux

  • Security

    :Device identity

  • Rating

    :Catalog

  • Operating temperature range (C)

    :-40 to 85

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
TI
23+
NA
24
專業(yè)電子元器件供應(yīng)鏈正邁科技特價代理特價,原裝元器件供應(yīng),支持開發(fā)樣品
詢價
TI
23+
原廠封裝
13528
振宏微原裝正品,假一罰百
詢價
TI
24+
NFBGA|289
70230
免費送樣原盒原包現(xiàn)貨一手渠道聯(lián)系
詢價
TI
2008
BGA
156
原裝現(xiàn)貨海量庫存歡迎咨詢
詢價
TI/德州儀器
23+
BGA
3000
一級代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
詢價
TI
25+
BGA (ZDY)
6000
原廠原裝,價格優(yōu)勢
詢價
TI
25+23+
BGA
53408
絕對原裝正品現(xiàn)貨,全新深圳原裝進(jìn)口現(xiàn)貨
詢價
TI
20+
原廠封裝
6965
英卓爾原裝現(xiàn)貨!0755-82566558真實庫存!
詢價
4
394
原裝正品
詢價
TI
24+
BGA288
3629
原裝優(yōu)勢!房間現(xiàn)貨!歡迎來電!
詢價