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OMAP3503

Sitara 處理器：Arm Cortex-A8、LPDDR; ? OMAP3 Devices: \n? OMAP? 3 Architecture\n? MPU Subsystem \n? Up to 720-MHz ARM? Cortex?-A8 Core\n? NEON? SIMD Coprocessor\n \n? PowerVR? SGX? Graphics Accelerator \n? Tile-Based Architecture Delivering up to 1 MPoly/sec \n? Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality\n? Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0\n? Fine-Grained Task Switching, Load Balancing, and Power Management\n? Programmable High-Quality Image Anti-Aliasing\n \n? Fully Software-Compatible with ARM9?\n? Commercial and Extended Temperature Grades\n \n? ARM Cortex-A8 Core \n? ARMv7 Architecture \n? TrustZone?\n? Thumb?-2\n? MMU Enhancements\n \n? In-Order, Dual-Issue, Superscalar Microprocessor Core\n? NEON Multimedia Architecture\n? Over 2x Performance of ARMv6 SIMD\n? Supports Both Integer and Floating-Point SIMD\n? Jazelle? RCT Execution Environment Architecture\n? Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack\n? Embedded Trace Macrocell (ETM) Support for Noninvasive Debug\n \n? ARM Cortex-A8 Memory Architecture: \n? -KB Instruction Cache (4-Way Set-Associative)\n? -KB Data Cache (4-Way Set-Associative)\n? -KB L2 Cache\n \n? 112KB of ROM\n? 64KB of Shared SRAM\n? Endianess: \n? ARM Instructions – Little Endian\n? ARM Data – Configurable\n \n? External Memory Interfaces: \n? General Purpose Memory Controller (GPMC) \n? 16-Bit-Wide Multiplexed Address and Data Bus\n? Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin\n? Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM\n? Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)\n? Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space) \n \n \n? System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)\n? Camera Image Signal Processor (ISP) \n? CCD and CMOS Imager Interface\n? Memory Data Input\n? BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface\n? Glueless Interface to Common Video Decoders\n? Resize Engine \n? Resize Images From 1/4x to 4x\n? Separate Horizontal and Vertical Control\n \n \n? Display Subsystem \n? Parallel Digital Output \n? Up to 24-Bit RGB\n? HD Maximum Resolution\n? Supports Up to 2 LCD Panels\n? Support for Remote Frame Buffer Interface (RFBI) LCD Panels\n \n? 2 10-Bit Digital-to-Analog Converters (DACs) Supporting: \n? Composite NTSC and PAL Video\n? Luma and Chroma Separate Video (S-Video)\n \n? Rotation 90-, 180-, and 270-Degrees\n? Resize Images From 1/4x to 8x\n? Color Space Converter\n? 8-Bit Alpha Blending\n \n? Serial Communication \n? 5 Multichannel Buffered Serial Ports (McBSPs) \n? 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)\n? 5-KB Transmit and Receive Buffer (McBSP2)\n? SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations\n? Direct Interface to I2S and PCM Device and TDM Buses\n? 128-Channel Transmit and Receive Mode\n \n? Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports\n? High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)\n? High-, Full-, and Low-Speed Multiport USB Host Subsystem \n? 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface\n \n? One HDQ?/1-Wire? Interface\n? UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)\n? Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers\n \n? Removable Media Interfaces: \n? Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO) \n \n? Comprehensive Power, Reset, and Clock Management \n? SmartReflex? Technology\n? Dynamic Voltage and Frequency Scaling (DVFS)\n \n? Test Interfaces \n? IEEE 1149.1 (JTAG) Boundary-Scan Compatible\n? ETM Interface\n? Serial Data Transport Interface (SDTI) \n \n? 12 32-Bit General-Purpose Timers\n? 2 32-Bit Watchdog Timers\n? 1 32-Bit 32-kHz Sync Timer\n? Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)\n? 5-nm CMOS Technologies\n? Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)\n? Discrete Memory Interface \n? Packages: \n \n? 1.8-V I/O and 3.0-V (MMC1 Only), Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.;

devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:Streaming video Video conferencing High-resolution still imageThe device supports high-level operating systems (HLOSs), such as:Linux?Windows? CE Android?This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device:Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only) Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensorsDisplay subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripheralsThe device also offers:A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences). This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections: Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics Section 4: Clock Specifications input and output clocks, DPLL and DLLSection 5: Video Dac Specifications Section 6: Timing Requirements and Switching Characteristics Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging \n\ndevices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:Streaming video Video conferencing High-resolution still imageThe device supports high-level operating systems (HLOSs), such as:Linux?Windows? CE Android?This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device:Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only) Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensorsDisplay subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripheralsThe device also offers:A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences). This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections: Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics Section 4: Clock Specifications input and output clocks, DPLL and DLLSection 5: Video Dac Specifications Section 6: Timing Requirements and Switching Characteristics Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging \n\n

OMAP3503

Applications Processor

OMAP3503

Applications Processor

OMAP3503

Applications Processors

OMAP3503

OMAP3515 and OMAP3503 Applications Processors

OMAP3503

OMAP3515/03 Applications Processor

OMAP3503

OMAP3515 and OMAP3503 Applications Processors

OMAP3503

OMAP3515 and OMAP3503 Applications Processors

OMAP3503-HIREL

應(yīng)用處理器; ? OMAP3503 Applications Processor: \n - OMAP? 3 Architecture\n? MPU Subsystem \n - Up to 720-MHz ARM Cortex?-A8 Core\n? NEON? SIMD Coprocessor\n? Fully Software-Compatible With ARM9?\n? Commercial and Extended Temperature Grades\n? ARM Cortex?-A8 Core \n - ARMv7 Architecture \n - Trust Zone?\n? Thumb?-2\n? MMU Enhancements\n? In-Order, Dual-Issue, Superscalar Microprocessor Core\n? NEON? Multimedia Architecture\n? Over 2x Performance of ARMv6 SIMD\n? Supports Both Integer and Floating Point SIMD\n? Jazelle? RCT Execution Environment Architecture\n? Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack\n? Embedded Trace Macrocell (ETM) Support for Non-Invasive Debug\n? ARM Cortex?-A8 Memory Architecture: \n - K-Byte Instruction Cache (4-Way Set-Associative)\n? K-Byte Data Cache (4-Way Set-Associative)\n? K-Byte L2 Cache\n? 112K-Byte ROM\n? 64K-Byte Shared SRAM\n? Endianess:\n - ARM Instructions - Little Endian\n? ARM Data – Configurable\n? External Memory Interfaces: \n - SDRAM Controller (SDRC) \n - 16, 32-bit Memory Controller With 1G-Byte Total Address Space\n? Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM\n? SDRAM Memory Scheduler (SMS) and Rotation Engine\n? SDRAM Controller (SDRC) \n - 16, 32-bit Memory Controller With 1G-Byte Total Address Space\n? Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM\n? SDRAM Memory Scheduler (SMS) and Rotation Engine\n? General Purpose Memory Controller (GPMC) \n - 16-bit Wide Multiplexed Address/Data Bus\n? Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin\n? Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM\n? Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)\n? Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space) \n\n? System Direct Memory Access (sDMA) Controller (32 Logical Channels With Configurable Priority)\n? Camera Image Signal Processing (ISP) \n - CCD and CMOS Imager Interface\n? Memory Data Input\n? RAW Data Interface\n? BT.601/BT.656 Digital YCbCr 4:2:2 (8-/10-Bit) Interface\n? A-Law Compression and Decompression\n? Preview Engine for Real-Time Image Processing\n? Glueless Interface to Common Video Decoders\n? Histogram Module/Auto-Exposure, Auto-White Balance, and Auto-Focus Engine\n? Resize Engine \n - Resize Images From 1/4x to 4x\n? Separate Horizontal/Vertical Control\n\n? Display Subsystem \n - Parallel Digital Output \n - Up to 24-Bit RGB\n? HD Maximum Resolution\n? Supports Up to 2 LCD Panels\n? Support for Remote Frame Buffer Interface (RFBI) LCD Panels\n? 2 10-Bit Digital-to-Analog Converters (DACs) Supporting: \n - Composite NTSC/PAL Video\n? Luma/Chroma Separate Video (S-Video)\n? Rotation 90-, 180-, and 270-degrees\n? Resize Images From 1/4x to 8x\n? Color Space Converter\n? 8-bit Alpha Blending\n? Serial Communication \n - 5 Multichannel Buffered Serial Ports (McBSPs) \n - 512 Byte Transmit/Receive Buffer (McBSP1/3/4/5)\n? 5K-Byte Transmit/Receive Buffer (McBSP2)\n? SIDETONE Core Support (McBSP2 and 3 Only) For Filter, Gain, and Mix Operations\n? Direct Interface to I2S and PCM Device and TDM Buses\n? 128 Channel Transmit/Receive Mode\n? Four Master/Slave Multichannel Serial Port Interface (McSPI) Ports\n? High-Speed/Full-Speed/Low-Speed USB OTG Subsystem (12-/8-Pin ULPI Interface)\n? High-Speed/Full-Speed/Low-Speed Multiport USB Host Subsystem \n - 12-/8-Pin ULPI Interface or 6-/4-/3-Pin Serial Interface\n? Supports Transceiverless Link Logic (TLL)\n? One HDQ/1-Wire Interface\n? Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)\n? Three Master/Slave High-Speed Inter-Integrated Circuit (I2C) Controllers\n? Removable Media Interfaces: \n - Three Multimedia Card (MMC)/ Secure Digital (SD) With Secure Data I/O (SDIO) \n \n? Comprehensive Power, Reset, and Clock Management \n - SmartReflex? Technology\n? Dynamic Voltage and Frequency Scaling (DVFS)\n? Test Interfaces \n - IEEE-1149.1 (JTAG) Boundary-Scan Compatible\n? Embedded Trace Macro Interface (ETM)\n? Serial Data Transport Interface (SDTI)\n? 12 32-bit General Purpose Timers\n? 2 32-bit Watchdog Timers\n? 1 32-bit 32-kHz Sync Timer\n? Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)\n? 65-nm CMOS Technology\n? Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)\n? Discrete Memory Interface (Not Available in CBC Package)\n? Packages:\n \n - 515-pin s-PBGA package (CBB Suffix), .5mm Ball Pitch (Top),.4mm Ball Pitch (Bottom)\n? 515-pin s-PBGA package (CBC Suffix), .65mm Ball Pitch (Top),.5mm Ball Pitch (Bottom)\n? 423-pin s-PBGA package (CUS Suffix), .65mm Ball Pitch\n? 1.8-V I/O and 3.0-V (MMC1 only), 0.985-V to 1.35-V Adaptive Processor Core Voltage 0.985-V to 1.35-V Adaptive Core Logic Voltage Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex? AVS.\n? Applications: \n - Portable Navigation Devices\n? Portable Media Player\n? Advanced Portable Consumer Electronics\n? Digital TV\n? Digital Video Camera\n? Portable Data Collection\n? Point-of-Sale Devices\n? Gaming\n? Web Tablet\n? Smart White Goods\n? Smart Home Controllers\n? Ultra Mobile Devices\n\n HiRel currently offers only CBC package.For CBB and CUS packages please contact TI sales. OMAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.;

OMAP3503 high-performance, applications processor is based on the enhanced OMAP? 3 architecture.\n The OMAP? 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:\n Streaming video 3D mobile gaming Video conferencing High-resolution still image The device supports high-level operating systems (OSs), such as:\n Linux Windows CE This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.\n The following subsystems are part of the device:\n Microprocessor unit (MPU) subsystem based on the ARM Cortex?-A8 microprocessor Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers:\n A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex? adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption. Memory stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only) OMAP3503 is available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package.\n Table 1-1 lists the differences between the CBB, CBC, and CUS packages.\n This OMAP3503 Applications Processor data manual presents the electrical and mechanical specifications for the OMAP3503 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the OMAP3503 Applications Processor unless otherwise indicated. It consists of the following sections:\n A description of the OMAP3503 terminals: assignment, electrical characteristics, multiplexing, and functional description (Section 2) A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics (Section 3) The clock specifications: input and output clocks, DPLL and DLL (Section 4) The video DAC specification (Section 5) The timing requirements and switching characteristics (ac timings) of the interfaces (Section 6) A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging (Section 7) \n

OMAP3503DCBB

OMAP3515 and OMAP3503 Applications Processors