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MPC8270ZQ

PowerQUICC II Family Hardware Specifications

MotorolaMotorola, Inc

摩托羅拉加爾文制造公司

MPC8270ZQ

MPC8280 PowerQUICC II Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQMIBA

PowerQUICC, 32 Bit Power Architecture, 266MHz, Comms Processor, PCI, USB, HDLC, Enet, 0 to 105C; MPC8270ZQ/VR Features\n? 603e core with 16K inst and 16K data caches\n? 64-bit 60x bus, 32-bit PCI/local bus\n? 128K ROM, 32K IRAM, 32K DPRAM\n? Three FCCs for 10/100 Ethernet\n? 128 HDLC channels, 4 TDMs\n? 4 SCCs, 2 SMCs, SPI, I2C\n? Memory controller built from SDRAM, UPM, GPCM machines\n? New features -- USB, RMII\n? Performance? 266 MHz CPU, 200 MHz CPM, 66 MHz bus\n? ~ 1W @ full performance, 1.5V\n? Technology? HIP7AP .13 micron, 3.3V I/O, 1.5V Core\n? 516 PBGA, 27x27mm, 1mm ball pitch? ZQ package has lead-bearing spheres\n? VR package is lead-free\n\nMPC8270ZU (480 TBGA) Features\n? 603e core with 16K inst and 16K data caches\n? 64-bit 60x bus, 32-bit PCI bus\n? 128K ROM, 32K IRAM, 32K DPRAM\n? Three FCCs for 10/100 Ethernet\n? 128 HDLC channels, 4 TDMs\n? 4 SCCs, 2 SMCs, SPI, I2C\n? Memory controller built from SDRAM, UPM, GPCM machines\n? New features -- USB, RMII\n? Performance? 333 MHz CPU, 250 MHz CPM, 83 MHz bus\n? 450 MHz CPU, 300 MHz CPM, 100 MHz bus\n? Less than 2W @ full performance, 1.5V\n? Technology? HIP7AP, 3.3V I/O, 1.5V Core\n? 480 TBGA, 37.5x37.5mm, 1.27mm ball pitch\n;

Introducing the next generation of PowerQUICC? II? processors: the MPC8270, MPC8275 and MPC8280.\nUtilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.\nThe next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e? core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.\nA range of performance and package options\nTaking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.\nThe next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.\n

NXPNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MPC8270ZQB

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQE

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQI

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQM

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQMIBA

PowerQUICC II Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQP

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270ZQT

PowerQUICC II??Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

詳細(xì)參數(shù)

  • 型號(hào):

    MPC8270ZQ

  • 制造商:

    MOTOROLA

  • 制造商全稱:

    Motorola, Inc

  • 功能描述:

    PowerQUICC II Family Hardware Specifications

供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
FREESCAL
23+
BGA
19726
詢價(jià)
MOROTOLA
23+
BGA
2870
絕對(duì)全新原裝!現(xiàn)貨!特價(jià)!請(qǐng)放心訂購!
詢價(jià)
MOTOLOLA
16+
TQFP144
4000
進(jìn)口原裝現(xiàn)貨/價(jià)格優(yōu)勢(shì)!
詢價(jià)
FREESCALE
2016+
BGA
5500
只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
詢價(jià)
FREE
24+
BGA
71
詢價(jià)
MOT
24+
BGA
6980
原裝現(xiàn)貨,可開13%稅票
詢價(jià)
MC
23+
BGA
5000
原裝正品,假一罰十
詢價(jià)
FREESCAL
25+
QFP
500
保證有貨!質(zhì)優(yōu)價(jià)美!歡迎查詢!!
詢價(jià)
MOTO
24+
BGA
2866
原裝現(xiàn)貨假一罰十
詢價(jià)
Freesca
16+
BGA
8800
進(jìn)口原裝大量現(xiàn)貨熱賣中
詢價(jià)
更多MPC8270ZQ供應(yīng)商 更新時(shí)間2025-7-28 16:17:00