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MPC8270CZQMIBA

PowerQUICC, 32 Bit Power Architecture, 266MHz, Comms Processor, PCI, USB, HDLC, Enet, -40 to 105C; MPC8270ZQ/VR Features\n? 603e core with 16K inst and 16K data caches\n? 64-bit 60x bus, 32-bit PCI/local bus\n? 128K ROM, 32K IRAM, 32K DPRAM\n? Three FCCs for 10/100 Ethernet\n? 128 HDLC channels, 4 TDMs\n? 4 SCCs, 2 SMCs, SPI, I2C\n? Memory controller built from SDRAM, UPM, GPCM machines\n? New features -- USB, RMII\n? Performance? 266 MHz CPU, 200 MHz CPM, 66 MHz bus\n? ~ 1W @ full performance, 1.5V\n? Technology? HIP7AP .13 micron, 3.3V I/O, 1.5V Core\n? 516 PBGA, 27x27mm, 1mm ball pitch? ZQ package has lead-bearing spheres\n? VR package is lead-free\n\nMPC8270ZU (480 TBGA) Features\n? 603e core with 16K inst and 16K data caches\n? 64-bit 60x bus, 32-bit PCI bus\n? 128K ROM, 32K IRAM, 32K DPRAM\n? Three FCCs for 10/100 Ethernet\n? 128 HDLC channels, 4 TDMs\n? 4 SCCs, 2 SMCs, SPI, I2C\n? Memory controller built from SDRAM, UPM, GPCM machines\n? New features -- USB, RMII\n? Performance? 333 MHz CPU, 250 MHz CPM, 83 MHz bus\n? 450 MHz CPU, 300 MHz CPM, 100 MHz bus\n? Less than 2W @ full performance, 1.5V\n? Technology? HIP7AP, 3.3V I/O, 1.5V Core\n? 480 TBGA, 37.5x37.5mm, 1.27mm ball pitch\n;

Introducing the next generation of PowerQUICC? II? processors: the MPC8270, MPC8275 and MPC8280.\nUtilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.\nThe next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Our PowerQUICC II processors include a high-performance embedded 603e? core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.\nA range of performance and package options\nTaking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.\nThe next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.\n

NXPNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MPC8270CZQMIBA

MPC8280 PowerQUICC II Family Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZQP

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZQT

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUB

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUE

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUI

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUM

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUP

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8270CZUT

PowerQUICCII??FamilyHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

詳細(xì)參數(shù)

  • 型號:

    MPC8270CZQMIB

  • 功能描述:

    微處理器 - MPU PQ II HIP 7 REV A ZQ

  • RoHS:

  • 制造商:

    Atmel

  • 處理器系列:

    SAMA5D31

  • 核心:

    ARM Cortex A5

  • 數(shù)據(jù)總線寬度:

    32 bit

  • 最大時鐘頻率:

    536 MHz

  • 程序存儲器大?。?/span>

    32 KB 數(shù)據(jù) RAM

  • 大小:

    128 KB

  • 接口類型:

    CAN, Ethernet, LIN, SPI,TWI, UART, USB

  • 工作電源電壓:

    1.8 V to 3.3 V

  • 最大工作溫度:

    + 85 C

  • 安裝風(fēng)格:

    SMD/SMT

  • 封裝/箱體:

    FBGA-324

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更多MPC8270CZQMIB供應(yīng)商 更新時間2025-7-28 10:01:00