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零件型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

MO-298

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkorAmkor Technology

安靠封裝測試安靠封裝測試(上海)有限公司

NTE298

SiliconComplementaryTransistorsAudioAmplifier,Driver

Features: ●HighCollector–EmitterVoltage ●Idealfor25–30WLow–FrequencyOutputDrive

NTE

NTE Electronics

OP298

GaAlAsPlasticInfraredEmittingDiodes

PlasticInfraredEmittingDiodeOP290Series Description: Eachdeviceinthisseries,isagalliumaluminumarsenideinfraredLightEmittingDiode(LED)thatismoldedinanIR-transmissivepackagewithawavelengthcenteredat890nm,whichcloselymatchesthespectralresponseofsiliconphoto

Optek

OPTEK Technologies

OP298A

GaAlAsPlasticInfraredEmittingDiodes

PlasticInfraredEmittingDiodeOP290Series Description: Eachdeviceinthisseries,isagalliumaluminumarsenideinfraredLightEmittingDiode(LED)thatismoldedinanIR-transmissivepackagewithawavelengthcenteredat890nm,whichcloselymatchesthespectralresponseofsiliconphoto

Optek

OPTEK Technologies

MO54ZBN

NUVOTON
NA

NuvotonNuvoton Technology Corporation

新唐科技新唐科技股份有限公司

上傳:京海半導體(深圳)有限公司

供應商型號品牌批號封裝庫存備注價格
24+
5000
公司存貨
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N/A
23+
NA
141
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更多MO-298供應商 更新時間2025-7-31 16:01:00