首頁(yè) >MAX732WC>規(guī)格書列表
零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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PackagePLCC52 | ZMD Zentrum Mikroelektronik Dresden AG | ZMD | ||
TypeMKPrecisionPowerFilmRadial-LeadResistors | Caddock Caddock Electronics, Inc. | Caddock | ||
SMTVoltageControlledOscillator | BOWEIBOWEI Integrated Circuits CO.,LTD. 博威集成電路河北博威集成電路有限公司 | BOWEI | ||
3WATTGLASSZENERDIODES FEATURES ●Microminiaturepackage. ●Voidlesshermeticallysealedglasspackage. ●Triplelayerpassivation. ●Metallurgicallybonded. ●Highperformancecharacteristics. ●Stableoperationattemperatureto200°C ●Verylowthermalimpedance. | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
LongDistanceReflectiveSwitch Description: OPB732usesanInfraredLEDandPhototransistorinareflectiveswitchconfiguration.TheassemblyisofferedwitheitherPCBoardthroughholepins(OPB732)or24”(610mm),26AWGwires(OPB732WZ),andusesanopaquehousingtoreducethesensor’sambientlightsensitivity.Theemit | Optek OPTEK Technologies | Optek | ||
LongDistanceReflectiveSwitch Description: OPB732usesanInfraredLEDandPhototransistorinareflectiveswitchconfiguration.TheassemblyisofferedwitheitherPCBoardthroughholepins(OPB732)or24”(610mm),26AWGwires(OPB732WZ),andusesanopaquehousingtoreducethesensor’sambientlightsensitivity.Theemi | TTELECTT Electronics. TT電子公司梯梯電子集成制造服務(wù)(蘇州)有限公司 | TTELEC | ||
LongDistanceReflectiveSwitch Description: OPB732usesanInfraredLEDandPhototransistorinareflectiveswitchconfiguration.TheassemblyisofferedwitheitherPCBoardthroughholepins(OPB732)or24”(610mm),26AWGwires(OPB732WZ),andusesanopaquehousingtoreducethesensor’sambientlightsensitivity.Theemit | Optek OPTEK Technologies | Optek | ||
LongDistanceReflectiveSwitch Description: OPB732usesanInfraredLEDandPhototransistorinareflectiveswitchconfiguration.TheassemblyisofferedwitheitherPCBoardthroughholepins(OPB732)or24”(610mm),26AWGwires(OPB732WZ),andusesanopaquehousingtoreducethesensor’sambientlightsensitivity.Theemi | TTELECTT Electronics. TT電子公司梯梯電子集成制造服務(wù)(蘇州)有限公司 | TTELEC | ||
Channelstyleheatsinkwithfoldedbackfins Channelstyleheatsinkwithfoldedbackfinsforincreasedcoolingsurfacearea.Availablewithtinplatedsolderabletabsforeasyattachmenttotheprintedcircuitcard. | AAVIDAavid, Thermal Division of Boyd Corporation 愛美達(dá) | AAVID | ||
HowtoUseThisCatalog | AAVIDAavid, Thermal Division of Boyd Corporation 愛美達(dá) | AAVID |
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