描述 Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

特性 Features

Surface Mount Device

No Wirebonds Required

Rugged Silicon-Glass Construction

Silicon Nitride Passivation

Polymer Scratch Protection

Ultra-Low Parasitic Capacitance and Inductance

Higher Power Handling ( Efficient Heat sinking )