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LSM6DS3

iNEMO inertial module: 3D accelerometer and 3D gyroscope; ? Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.\n? “Always-on” experience with low power consumption for both accelerometer and gyroscope\n? Smart FIFO up to 8 kbyte based on features set\n? Compliant with Android K and L\n? Hard, soft ironing for external magnetic sensor corrections\n? ±2/±4/±8/±16 g full scale\n? ±125/±250/±500/±1000/±2000 dps full scale? Analog supply voltage: 1.71 V to 3.6 V\n? Independent IOs supply (1.62 V)\n? Compact footprint, 2.5 mm x 3 mm x 0.83 mm\n? SPI/I2C serial interface with main processor data synchronization feature\n? Embedded temperature sensor\n? ECOPACK?, RoHS and “Green” compliant;

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.\n The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.\n ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.\n The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.\n The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.\n High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.\n The LSM6DS3 is available in a plastic land grid array (LGA) package.\n

LSM6DS3

always-on 3D accelerometer and 3D gyroscope

LSM6DS3H

iNEMO inertial module: 3D accelerometer and 3D gyroscope; ? Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.\n? “Always-on” experience with low power consumption for both accelerometer and gyroscope\n? Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor\n? Auxiliary SPI (3-wire) to support OIS applications\n? EIS/OIS support\n? Accelerometer ODR up to 6.66 kHz\n? Gyroscope ODR up to 3.33 kHz\n? Smart FIFO? ±2/±4/±8/±16 g full scale\n? ±125/±245/±500/±1000/±2000 dps full scale\n? Analog supply voltage: 1.71 V to 3.6 V\n? Independent IOs supply (1.62 V)\n? Compact footprint, 2.5 mm x 3 mm x 0.83 mm\n? SPI/I2C serial interface data synchronization feature\n? Embedded temperature sensor\n? ECOPACK?, RoHS and “Green” compliant;

The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.\n The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.\n The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).\n ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.\n The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.\n The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.\n High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.\n The LSM6DS3H is available in a plastic land grid array (LGA) package.\n

LSM6DS3TR-C

iNEMO inertial module always-on 3D accelerometer and 3D gyroscope

Features ?“Always-on”experiencewithlowpower consumptionforbothaccelerometerandgyroscope ?Powerconsumption:0.90mAincombohighperformance mode ?SmartFIFOupto4kbytebasedonfeaturesset ?AndroidMcompliant ?Hard,softironingforexternalmagneticsensor corrections

LSM6DS33

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

LSM6DS33TR

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

LSM6DS33TR

慣性測量單元（IMU）;

LSM6DS3H

always-on 3D accelerometer and 3D gyroscope

LSM6DS3HTR

always-on 3D accelerometer and 3D gyroscope

LSM6DS3TR

always-on 3D accelerometer and 3D gyroscope