DESCRIPTION

STATS ChipPAC’s LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated

package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs

with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications.

FEATURES

? Body Sizes: 7 x 7mm to 28 x 28mm

? Package Height: 1.4mm

? Lead Counts: 32L to 208L

? Lead Pitch: 0.80mm to 0.40mm

? Wide range of open tool leadframe and die pad sizes available

? Moisture Sensitivity: JEDEC Level 3

? JEDEC standard compliant

? Lead-free and Green materials sets available

? Copper and alloy leadframes available

APPLICATIONS

? 3D Graphics

? Multimedia

? PC Chipsets

? Video / Audio

? Telecom

? Disc Drives

? Communication Boards (Ethernet, ISDN)