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首頁>LMV1032UR-25SLASHNOPB>規(guī)格書詳情

LMV1032UR-25SLASHNOPB中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

LMV1032UR-25SLASHNOPB
廠商型號

LMV1032UR-25SLASHNOPB

功能描述

LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

文件大小

576.07 Kbytes

頁面數(shù)量

20

生產(chǎn)廠商 Texas Instruments
企業(yè)簡稱

TI2德州儀器

中文名稱

美國德州儀器公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-8-5 17:01:00

人工找貨

LMV1032UR-25SLASHNOPB價格和庫存,歡迎聯(lián)系客服免費人工找貨

LMV1032UR-25SLASHNOPB規(guī)格書詳情

1FEATURES

2? (Typical LMV1032-15, 1.7V Supply; Unless

Otherwise Noted)

? Output Voltage Noise (A-weighted) ?89 dBV

? Low Supply Current 60 μA

? Supply Voltage 1.7V to 5V

? PSRR 70 dB

? Signal to Noise Ratio 61 dB

? Input Capacitance 2 pF

? Input Impedance >100 MΩ

? Output Impedance <200Ω

? Max Input Signal 170 mVPP

? Temperature Range ?40°C to 85°C

? Large Dome 4-Bump DSBGA Package with

Improved Adhesion Technology.

APPLICATIONS

? Mobile Communications - Bluetooth

? Automotive Accessories

? Cellular Phones

? PDAs

? Accessory Microphone Products

DESCRIPTION

The LMV1032s are an audio amplifier series for small

form factor electret microphones. They are designed

to replace the JFET preamp currently being used.

The LMV1032 series is ideal for extended battery life

applications, such as a Bluetooth communication link.

The addition of a third pin to an electret microphones

that incorporates an LMV1032 allows for a dramatic

reduction in supply current as compared to the JFET

equipped electret microphone. Microphone supply

current is thus reduced to 60 μA, assuring longer

battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed

voltage gains of 6 dB, 15 dB and 25 dB.

The LMV1032 series offers low output impedance

over the voice bandwidth, excellent power supply

rejection (PSRR), and stability over temperature.

The devices are offered in space saving 4-bump ultra

thin DSBGA lead free packages and are thus ideally

suited for the form factor of miniature electret

microphone packages. These extremely miniature

packages have the Large Dome Bump (LDB)

technology. This DSBGA technology is designed for

microphone PCBs requiring 1 kg adhesion criteria.

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