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首頁>LMV1032UPX-06SLASHNOPB>規(guī)格書詳情

LMV1032UPX-06SLASHNOPB中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

LMV1032UPX-06SLASHNOPB
廠商型號

LMV1032UPX-06SLASHNOPB

功能描述

LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

文件大小

576.07 Kbytes

頁面數(shù)量

20

生產(chǎn)廠商 Texas Instruments
企業(yè)簡稱

TI2德州儀器

中文名稱

美國德州儀器公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-8-3 23:00:00

人工找貨

LMV1032UPX-06SLASHNOPB價格和庫存,歡迎聯(lián)系客服免費人工找貨

LMV1032UPX-06SLASHNOPB規(guī)格書詳情

1FEATURES

2? (Typical LMV1032-15, 1.7V Supply; Unless

Otherwise Noted)

? Output Voltage Noise (A-weighted) ?89 dBV

? Low Supply Current 60 μA

? Supply Voltage 1.7V to 5V

? PSRR 70 dB

? Signal to Noise Ratio 61 dB

? Input Capacitance 2 pF

? Input Impedance >100 MΩ

? Output Impedance <200Ω

? Max Input Signal 170 mVPP

? Temperature Range ?40°C to 85°C

? Large Dome 4-Bump DSBGA Package with

Improved Adhesion Technology.

APPLICATIONS

? Mobile Communications - Bluetooth

? Automotive Accessories

? Cellular Phones

? PDAs

? Accessory Microphone Products

DESCRIPTION

The LMV1032s are an audio amplifier series for small

form factor electret microphones. They are designed

to replace the JFET preamp currently being used.

The LMV1032 series is ideal for extended battery life

applications, such as a Bluetooth communication link.

The addition of a third pin to an electret microphones

that incorporates an LMV1032 allows for a dramatic

reduction in supply current as compared to the JFET

equipped electret microphone. Microphone supply

current is thus reduced to 60 μA, assuring longer

battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed

voltage gains of 6 dB, 15 dB and 25 dB.

The LMV1032 series offers low output impedance

over the voice bandwidth, excellent power supply

rejection (PSRR), and stability over temperature.

The devices are offered in space saving 4-bump ultra

thin DSBGA lead free packages and are thus ideally

suited for the form factor of miniature electret

microphone packages. These extremely miniature

packages have the Large Dome Bump (LDB)

technology. This DSBGA technology is designed for

microphone PCBs requiring 1 kg adhesion criteria.

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
NS
24+
NA/
3000
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票
詢價
NS/美國國半
25+
QFN
54648
百分百原裝現(xiàn)貨 實單必成 歡迎詢價
詢價
NS
24+
QFN
990000
明嘉萊只做原裝正品現(xiàn)貨
詢價
TI
2025+
uSMD-4
16000
原裝優(yōu)勢絕對有貨
詢價
TI/
24+
4-XFBGA
5000
全新原裝正品,現(xiàn)貨銷售
詢價
NSC
24+
4-SMD
7500
詢價
TI
23+
4-XFBGA
5000
全新原裝,支持實單,非誠勿擾
詢價
TI
23+
4-XFBGA
3200
公司只做原裝,可來電咨詢
詢價
NS
22+
QFN
12000
只做原裝、原廠優(yōu)勢渠道、假一賠十
詢價
TI
16+
DSBGA
10000
原裝正品
詢價