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LMV1032UPX-06SLASHNOPB中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

廠商型號 |
LMV1032UPX-06SLASHNOPB |
功能描述 | LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones |
文件大小 |
576.07 Kbytes |
頁面數(shù)量 |
20 頁 |
生產(chǎn)廠商 | Texas Instruments |
企業(yè)簡稱 |
TI2【德州儀器】 |
中文名稱 | 美國德州儀器公司官網(wǎng) |
原廠標(biāo)識 | TI2 |
數(shù)據(jù)手冊 | |
更新時間 | 2025-8-3 23:00:00 |
人工找貨 | LMV1032UPX-06SLASHNOPB價格和庫存,歡迎聯(lián)系客服免費人工找貨 |
LMV1032UPX-06SLASHNOPB規(guī)格書詳情
1FEATURES
2? (Typical LMV1032-15, 1.7V Supply; Unless
Otherwise Noted)
? Output Voltage Noise (A-weighted) ?89 dBV
? Low Supply Current 60 μA
? Supply Voltage 1.7V to 5V
? PSRR 70 dB
? Signal to Noise Ratio 61 dB
? Input Capacitance 2 pF
? Input Impedance >100 MΩ
? Output Impedance <200Ω
? Max Input Signal 170 mVPP
? Temperature Range ?40°C to 85°C
? Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology.
APPLICATIONS
? Mobile Communications - Bluetooth
? Automotive Accessories
? Cellular Phones
? PDAs
? Accessory Microphone Products
DESCRIPTION
The LMV1032s are an audio amplifier series for small
form factor electret microphones. They are designed
to replace the JFET preamp currently being used.
The LMV1032 series is ideal for extended battery life
applications, such as a Bluetooth communication link.
The addition of a third pin to an electret microphones
that incorporates an LMV1032 allows for a dramatic
reduction in supply current as compared to the JFET
equipped electret microphone. Microphone supply
current is thus reduced to 60 μA, assuring longer
battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed
voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance
over the voice bandwidth, excellent power supply
rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra
thin DSBGA lead free packages and are thus ideally
suited for the form factor of miniature electret
microphone packages. These extremely miniature
packages have the Large Dome Bump (LDB)
technology. This DSBGA technology is designed for
microphone PCBs requiring 1 kg adhesion criteria.
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
NS |
24+ |
NA/ |
3000 |
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票 |
詢價 | ||
NS/美國國半 |
25+ |
QFN |
54648 |
百分百原裝現(xiàn)貨 實單必成 歡迎詢價 |
詢價 | ||
NS |
24+ |
QFN |
990000 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價 | ||
TI |
2025+ |
uSMD-4 |
16000 |
原裝優(yōu)勢絕對有貨 |
詢價 | ||
TI/ |
24+ |
4-XFBGA |
5000 |
全新原裝正品,現(xiàn)貨銷售 |
詢價 | ||
NSC |
24+ |
4-SMD |
7500 |
詢價 | |||
TI |
23+ |
4-XFBGA |
5000 |
全新原裝,支持實單,非誠勿擾 |
詢價 | ||
TI |
23+ |
4-XFBGA |
3200 |
公司只做原裝,可來電咨詢 |
詢價 | ||
NS |
22+ |
QFN |
12000 |
只做原裝、原廠優(yōu)勢渠道、假一賠十 |
詢價 | ||
TI |
16+ |
DSBGA |
10000 |
原裝正品 |
詢價 |