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首頁>LMV1015UR-25SLASHNOPB>規(guī)格書詳情

LMV1015UR-25SLASHNOPB中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

LMV1015UR-25SLASHNOPB
廠商型號

LMV1015UR-25SLASHNOPB

功能描述

LMV1015 Analog Series: Built-in Gain ICs for High Sensitivity 2-Wire Microphones

文件大小

457.77 Kbytes

頁面數(shù)量

16

生產(chǎn)廠商 Texas Instruments
企業(yè)簡稱

TI2德州儀器

中文名稱

美國德州儀器公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-8-4 23:00:00

人工找貨

LMV1015UR-25SLASHNOPB價格和庫存,歡迎聯(lián)系客服免費人工找貨

LMV1015UR-25SLASHNOPB規(guī)格書詳情

1FEATURES

2? (Typical LMV1015-15, 2.2V supply, RL = 2.2 kΩ,

C = 2.2 μF, V IN = 18 mVPP, unless otherwise

specified)

? Supply Voltage: 2V - 5V

? Supply Current: <180 μA

? Signal to Noise Ratio (A-Weighted): 60 dB

? Output Voltage Noise (A-Weighted): ?89 dBV

? Total Harmonic Distortion 0.09%

? Voltage Gain

– LMV1015-15: 15.6 dB

– LMV1015-25: 23.8 dB

? Temperature Range: ?40°C to 85°C

? Large Dome 4-Bump DSBGA Package with

Improved Adhesion Technology.

APPLICATIONS

? Cellular Phones

? Headsets

? Mobile Communications

? Automotive Accessories

? PDAs

? Accessory Microphone Products

DESCRIPTION

The LMV1015 is an audio amplifier series for small

form factor electret microphones. This 2-wire portfolio

is designed to replace the JFET amplifier. The

LMV1015 series is ideally suited for applications

requiring high signal integrity in the presence of

ambient or RF noise, such as in cellular

communications. The LMV1015 audio amplifiers are

ensured to operate over a 2.2V to 5.0V supply

voltage range with fixed gains of 15.6 dB and 23.8

dB. The devices offer excellent THD, gain accuracy

and temperature stability as compared to a JFET

microphone.

The LMV1015 series enables a two-pin electret

microphone solution, which provides direct pin-to-pin

compatibility with the existing older JFET market.

Texas Instruments' built-in gain families are offered in extremely thin space saving 4-bump DSBGA

packages (0.3 mm maximum). The LMV1015XR is

designed for 1.0 mm ECM canisters and thicker.

These extremely miniature packages have the Large

Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs

requiring 1 kg adhesion criteria.

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NS
24+
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23+
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17+
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9888
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18+
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