特性 Features

WiFi 802.11 b/g/n

Bluetooth? v4.1 specification (Dual Mode)

SDIO for WiFi and UART (High Speed) for Bluetooth

IPEX Connector or PCB Antenna options

Full speed Bluetooth? Piconet and Scatternet supported

Enterprise level security - WPA/WPA2 certification for WiFi

1T 1R, Supporting 150Mbps Bandwidth

Support sophisticated WiFi/BT coexistence mechanism to enhance collection performance

Support Bluetooth adaptive power management mechanism

19mm x 12mm x 2mm

SMT Side and Bottom Pads for easy production

See our website for this products certifications.

RoHS, REACH and WEEE

Overview

The LM832 module incorporates an intelligent coexistances mechanism for WiFi 802.11 b/g/n via SDIO and Dual Mode Bluetooth? v4.1 via UART. This is ideal for significantly minimising the BoM cost and PCB space.

This versatile module combines WiFi and Bluetooth? radios, plus an ARM Cortex M3 microcontroller with an 8 MB flash memory for running the application. It also incorporates 4 GPIO pins for interfacing with peripheral devices.

The LM832 utilises a powerful Cypress chipset, which enables the LM832 HCI Module to be compatible with the latest Android platform, Linux Kernel v4.3.6 and Android4.4_V2.19.

It’s SMT side and bottom pads allow for easy manufacture and placement within your product.