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Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 525 nm (● true green) - Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Aut

文件：1.90204 Mbytes 頁數(shù)：24 Pages

OSRAM

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 525 nm (● true green) - Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Aut

文件：1.90204 Mbytes 頁數(shù)：24 Pages

OSRAM

艾邁斯歐司朗

OSRAM OSRAM OSTAR? Projection Compact, KT CSLNM1.13

結構緊湊的光源設計，熱點分離的焊盤設計能夠提高散熱性能，高電流芯片技術可以提高光學輸出。

ams-OSRAM

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Color: λdom = 530 nm (● true green) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.80441 Mbytes 頁數(shù)：23 Pages

OSRAM

艾邁斯歐司朗

KEC
SOT89

KECKEC CORPORATION

KEC株式會社

上傳：深圳市興燦科技有限公司