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white molded SMD ceramic package

文件：762.16 Kbytes 頁數(shù)：24 Pages

OSRAM

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: Thinfilm - Color: λdom = 622 nm (● red) - Corrosion Robustness Class: 3B - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.87084 Mbytes 頁數(shù)：23 Pages

OSRAM

艾邁斯歐司朗

The SYNIOS? P1515 expands ams OSRAM’ low power portfolio by offering a small LED Industry standard footprint.

Features - Package: diffuse silicone, SMD epoxy package - Chip technology: Thinfilm - Color: λdom = 617 nm (● red) - Corrosion Robustness Class: 3B - Qualifications: AEC-Q102 Qualified - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ?

文件：1.95108 Mbytes 頁數(shù)：24 Pages

OSRAM

艾邁斯歐司朗

The SYNIOS? P1515 expands ams OSRAM’ low power portfolio by offering a small LED Industry standard footprint.

Features - Package: diffuse silicone, SMD epoxy package - Chip technology: Thinfilm - Color: λdom = 633 nm (● super red) - Corrosion Robustness Class: 3B - Qualifications: AEC-Q102 Qualified - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ?

文件：1.95167 Mbytes 頁數(shù)：24 Pages

OSRAM

艾邁斯歐司朗