首頁 >KDR730E-RTK/H>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
TFSCPACKAGE LOWCURRENTRECTIFICATION ANDHIGHSPEEDSWITCHING. FEATURES ?LowForwardVoltage. ?HighReliability. ?SmallPackage. ?SuffixU:QualifiedtoAEC-Q101. ex)KDR730F-RTK/HU | KECKEC CORPORATION KEC株式會社 | KEC | ||
SCHOTTKYBARRIERTYPEDIODE LOWCURRENTRECTIFICATIONANDHIGHSPEEDSWITCHING. FEATURES ?LowForwardVoltage. ?HighReliability. ?SmallPackage. | KECKEC CORPORATION KEC株式會社 | KEC | ||
10mmAdjustableShieldedRFCoil(I) | FRONTIER Frontier Electronics | FRONTIER | ||
10mmADJUSTABLERFCOILS(SHIELDED) | FRONTIER Frontier Electronics | FRONTIER | ||
10mmAdjustableShieldedRFCoil(I) | FRONTIER Frontier Electronics | FRONTIER | ||
EPITAXIALPLANARPNPTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式會社 | KEC | ||
EPITAXIALPLANARPNPTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式會社 | KEC | ||
AdvancedhighcelldenitytrenchtechnologyforultraRDS(ON) | KERSEMI Kersemi Electronic Co., Ltd. | KERSEMI | ||
Excellentpackageforgoodheatdissipation. | KERSEMI Kersemi Electronic Co., Ltd. | KERSEMI | ||
Lowgatecharge. | KERSEMI Kersemi Electronic Co., Ltd. | KERSEMI |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
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