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Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.97323 Mbytes 頁數(shù)：24 Pages

OSRAMOSRAM GmbH

艾邁斯歐司朗歐司朗光電半導(dǎo)體

OSRAM OSRAM OSTAR? Projection Compact, KB CSLNM1.14

結(jié)構(gòu)緊湊的光源設(shè)計，熱點分離的焊盤設(shè)計能夠提高散熱性能，高電流芯片技術(shù)可以提高光學(xué)輸出。;

ams-OSRAMams OSRAM Group

艾邁斯歐司朗

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.97323 Mbytes 頁數(shù)：24 Pages

OSRAMOSRAM GmbH

艾邁斯歐司朗歐司朗光電半導(dǎo)體

Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

Features - Package: white molded SMD ceramic package - Chip technology: UX:3 - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 455 nm (● blue) - Corrosion Robustness Class: 3A - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) ?

文件：1.97323 Mbytes 頁數(shù)：24 Pages

OSRAMOSRAM GmbH

艾邁斯歐司朗歐司朗光電半導(dǎo)體

PANJIT
DIP4

PANJITPan Jit International Inc.

強茂強茂股份有限公司

上傳：深圳市龍瀚電子有限公司