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IS61NLP102418-200B3I集成電路（IC）的存儲(chǔ)器規(guī)格書(shū)PDF中文資料
| 廠(chǎng)商型號(hào) |
IS61NLP102418-200B3I |
| 參數(shù)屬性 | IS61NLP102418-200B3I 封裝/外殼為165-TBGA；包裝為托盤(pán)；類(lèi)別為集成電路（IC）的存儲(chǔ)器；產(chǎn)品描述：IC SRAM 18MBIT PARALLEL 165TFBGA |
| 功能描述 | 256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM |
| 封裝外殼 | 165-TBGA |
| 文件大小 |
277.54 Kbytes |
| 頁(yè)面數(shù)量 |
35 頁(yè) |
| 生產(chǎn)廠(chǎng)商 | ISSI |
| 中文名稱(chēng) | 北京矽成 |
| 網(wǎng)址 | |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-8-9 23:01:00 |
| 人工找貨 | IS61NLP102418-200B3I價(jià)格和庫(kù)存，歡迎聯(lián)系客服免費(fèi)人工找貨 |
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IS61NLP102418-200B3I規(guī)格書(shū)詳情
DESCRIPTION
The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.
FEATURES
? 100 percent bus utilization
? No wait cycles between Read and Write
? Internal self-timed write cycle
? Individual Byte Write Control
? Single R/W (Read/Write) control pin
? Clock controlled, registered address, data and control
? Interleaved or linear burst sequence control using MODE input
? Three chip enables for simple depth expansion and address pipelining
? Power Down mode
? Common data inputs and data outputs
? CKE pin to enable clock and suspend operation
? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages
? Power supply:
NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)
NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)
? JTAG Boundary Scan for PBGA packages
? Industrial temperature available
? Lead-free available
產(chǎn)品屬性
- 產(chǎn)品編號(hào)：
IS61NLP102418-200B3I
- 制造商：
ISSI, Integrated Silicon Solution Inc
- 類(lèi)別：
集成電路（IC） > 存儲(chǔ)器
- 包裝：
托盤(pán)
- 存儲(chǔ)器類(lèi)型：
易失
- 存儲(chǔ)器格式：
SRAM
- 技術(shù)：
SRAM - 同步，SDR
- 存儲(chǔ)容量：
18Mb（1M x 18）
- 存儲(chǔ)器接口：
并聯(lián)
- 電壓 - 供電：
3.135V ~ 3.465V
- 工作溫度：
-40°C ~ 85°C（TA）
- 安裝類(lèi)型：
表面貼裝型
- 封裝/外殼：
165-TBGA
- 供應(yīng)商器件封裝：
165-TFBGA（13x15）
- 描述：
IC SRAM 18MBIT PARALLEL 165TFBGA
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
ISSI |
24+ |
NA/ |
3423 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開(kāi)票 |
詢(xún)價(jià) | ||
原裝ISSI |
09+ |
BGA |
173 |
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力 |
詢(xún)價(jià) | ||
ISSI, Integrated Silicon Solu |
23+ |
165-TFBGA13x15 |
7300 |
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢(xún)價(jià) | ||
ISSI |
BGA |
2732 |
正品原裝--自家現(xiàn)貨-實(shí)單可談 |
詢(xún)價(jià) | |||
ISSI |
2018+ |
BGA-156 |
6528 |
科恒偉業(yè)!承若只做進(jìn)口原裝正品假一賠十!1581728776 |
詢(xún)價(jià) | ||
ISSI |
25+ |
BGA |
16000 |
原裝優(yōu)勢(shì)絕對(duì)有貨 |
詢(xún)價(jià) | ||
ISSI Integrated Silicon Soluti |
23+/24+ |
165-TBGA |
8600 |
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨 |
詢(xún)價(jià) | ||
ISSI Integrated Silicon Soluti |
22+ |
165TFBGA (13x15) |
9000 |
原廠(chǎng)渠道,現(xiàn)貨配單 |
詢(xún)價(jià) | ||
ISSI |
18+ |
BGA-165 |
85600 |
保證進(jìn)口原裝可開(kāi)17%增值稅發(fā)票 |
詢(xún)價(jià) | ||
ISSI, Integrated Silicon Solu |
23+ |
165-TFBGA13x15 |
7300 |
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢(xún)價(jià) |
