描述 Description

Infineon’s XENSIV? MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.

特性 Features

? Ultra-low self-noise / ultra-high SNR (73 dB)
? Selectable power modes for battery critical applications (170/70 μA)
? Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
? Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
? Very tight part-to-part phase and sensitivity matching (± 1 dB)
? Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
? Ultra-low group delay (2μs @ 1kHz)

應(yīng)用 Application

? ANC Headphones
? Conference systems
? Smart speaker
? Surveillance
? Cameras

簡介

IM73A135屬于音頻設(shè)備產(chǎn)品的麥克風(fēng)。由制造生產(chǎn)的IM73A135麥克風(fēng)麥克風(fēng)是將聲音轉(zhuǎn)換成電信號(hào)以便存儲(chǔ)、傳輸和/或轉(zhuǎn)播的換能器。范圍從大型懸臂式麥克風(fēng)到常用的小型 MEMS 產(chǎn)品，并且可根據(jù)阻抗、額定電壓、靈敏度、頻率范圍、端口位置、整體尺寸和安裝類型進(jìn)行區(qū)分。輸出接口提供模擬、I2S、PDM 和 TDM 等種類。