FEATURES

? Lowest molded height (3.0 mm) in this package footprint

? Shielded construction

? Excellent DC/DC energy storage up to 5 MHz. Filter

inductor applications up to SRF (see “Standard Electrical

Specifications” table)

? Lowest DCR/μH, in this package size

? Handles high transient current spikes without saturation

? Ultra low buzz noise, due to composite construction

? Encapsulated body offers improved environmental

protection and moisture resistance

? Higher dielectric withstanding voltage vs IHLP

? Flame retardant encapsulant (UL 94 V-0)

? Corrosion resistant package

? Tin / lead Sn / Pb plated (not dipped) terminals

? IHLP design; PATENT(S): www.vishay.com/patents

APPLICATIONS

? Tolerance DCR for current sense applications

? Improved current balance in phased power supplies

? Improved thermal management

? PDA / notebook / desktop / server and battery powered

devices

? High current, low profile POL converters

? DC/DC converters in distributed power systems

? DC/DC converter for field programmable gate arrays

(FPGA)