描述 Description

Infineon Technologies introduces Double DPAK (DDPAK),?the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology?CoolSiC? Schottky diode 650V G6?is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

特性 Features

? Offers best-in-class VF and FOM Qc x VF
? Improved dv/dt ruggedness
? Easy and effective match with CoolMOS? 7 SJ MOSFET families
? Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
? Reduced parasitic source inductance improves e iciency and ease-of-use
? Enables higher power density solutions
? Exceeding the highest quality standards

優(yōu)勢:
? Enabling highest energy efficiency
? Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
? Reduced parasitic source inductance improves e iciency and ease-of-use
? Enables higher power density solutions
? Exceeding the highest quality standards

應(yīng)用 Application

Telecom, Server, Solar,?PC power?and SMPS

簡介

IDDD04G65C6屬于分立半導(dǎo)體產(chǎn)品的二極管-整流器-單。由制造生產(chǎn)的IDDD04G65C6二極管 - 整流器 - 單單整流器二極管系列產(chǎn)品可用于讓電流僅沿一個方向流動，并且每個器件封裝都恰好實現(xiàn)該功能的一個實例。其他用途的二極管（包括齊納二極管和可變電容二極管）單獨列在各自的產(chǎn)品系列中，每個器件封裝中包含多個二極管的產(chǎn)品也是如此。