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HZU3.0B2

SiliconEpitaxialPlanarZenerDiodesforStabilizer

Features ?UltrasmallResinPackage(URP)issuitableforsurfacemountdesign. ?Thesediodesaredeliveredtaped.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

PZU3.0B2

SingleZenerdiodesinaSOD323Fpackage

PhilipsPhilips Semiconductors

飛利浦荷蘭皇家飛利浦

PZU3.0B2L

SingleZenerdiodesinaSOD882package

1.1.Generaldescription General-purposeZenerdiodesinaSOD882leadlessultrasmallSurface-MountedDevice(SMD) plasticpackage. 1.2.Features ?Non-repetitivepeakrerversepowerdissipation:PZSM≤40W ?Totalpowerdissipation:Ptot≤250mW ?Toleranceseries:B:approximately±5

NEXPERIANexperia B.V. All rights reserved

安世安世半導體(中國)有限公司

RKZ3.0B2KJ

SiliconPlanarZenerDiodeforSurgeAbsorptionandStabilizer

Features ?EmbossTapingReelPack. ?UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

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