首頁 >HSMS-C670(J)>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SurfaceMountFlipChipLEDs Description TheHSMX-H670andHSMX-H690introducearevolutionaryconcepttotheworldofLEDs.Theinternalflipchipconstructioneliminatesthewirebondbetweenthechipandprintedcircuitboard.Consequentlyasaresultoftherobustconstruction,productreliabilityisgreatlyimproved. T | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
SurfaceMountChipLEDs Description ThesesingleandbicolorLEDsaredesignedinanindustrystandardpackageforeaseofhandlinganduse.FivedifferentLEDcolorsareavailableintwocompact,lowprofile,singlecolorpackages. Features ?SmallSize ?IndustryStandardFootprint ?LowProfile ?T | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
SurfaceMountFlipChipLEDs Description TheHSMX-H670andHSMX-H690introducearevolutionaryconcepttotheworldofLEDs.Theinternalflipchipconstructioneliminatesthewirebondbetweenthechipandprintedcircuitboard.Consequentlyasaresultoftherobustconstruction,productreliabilityisgreatlyimproved. T | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
HighPerformanceSurfaceMountChipLEDs | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
SurfaceMountChipLEDs Description ThesesingleandbicolorLEDsaredesignedinanindustrystandardpackageforeaseofhandlinganduse.FivedifferentLEDcolorsareavailableintwocompact,lowprofile,singlecolorpackages. Features ?SmallSize ?IndustryStandardFootprint ?LowProfile ?T | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
SurfaceMountFlipChipLEDs Description TheHSMX-H670andHSMX-H690introducearevolutionaryconcepttotheworldofLEDs.Theinternalflipchipconstructioneliminatesthewirebondbetweenthechipandprintedcircuitboard.Consequentlyasaresultoftherobustconstruction,productreliabilityisgreatlyimproved. T | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
Tasmysamospajalne-winylowe,mastyksowe W?asciwosci ??atwewuzyciuwinylowetasmymastyksowe ?Samoprzylepne-bezrozciagania ?Warstwamastycznabardzolepka,zapewniadoskona?aochrone przedwilgocia ?Winylowawarstwawierzchniazapewniadodatkowaochrone ?Nietracaw?asciwosciwniskichtemperaturach ?G?ównaizolacjaele | HellermannTytonHellermann Tyton 赫勒曼泰騰 | HellermannTyton | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION FEATURES ?WithBuilt-inBiasResistors. ?SimplifyCircuitDesign. ?ReduceaQuantityofPartsandManufacturingProcess. | KECKEC CORPORATION KEC株式會社 | KEC | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. | KECKEC CORPORATION KEC株式會社 | KEC | ||
CommonModeInductorForDC/DCPowersupply | RHOMBUS-IND Rhombus Industries Inc. | RHOMBUS-IND |
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